GS8322Z18B-200 GSI TECHNOLOGY, GS8322Z18B-200 Datasheet - Page 3

• Manufacturer Part Number: GS8322Z18B-200
• Manufacturer: GSI TECHNOLOGY

Specifications of GS8322Z18B-200

• Density: 36Mb
• Access Time (max): 7.5ns
• Sync/async: Synchronous
• Architecture: SDR
• Clock Freq (max): 133.3MHz
• Operating Supply Voltage (typ): 2.5/3.3V
• Address Bus: 21b
• Package Type: FBGA
• Operating Temp Range: 0C to 70C
• Number Of Ports: 2
• Supply Current: 170mA
• Operating Supply Voltage (min): 2.3/3V
• Operating Supply Voltage (max): 2.7/3.6V
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 119
• Word Size: 18b
• Number Of Words: 2M
• Lead Free Status / Rohs Status: Not Compliant

GS8322Z72 209-Bump BGA Pin Description
Rev: 1.07 4/2008
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
B
E
Symbol
, B
B
A
B
MCH
MCH
MCL
DQ
DQ
DQ
DQ
DQ
DQ
DQ
ADV
LBO
CKE
DQ
A
NC
CK
ZQ
0
An
C
ZZ
F
FT
E
E
E
W
G
, A
, B
, B
,B
1
3
2
C
D
G
H
A
B
E
F
D
1
B
G
,B
H
Type
I/O
—
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
Byte Write Enable for DQ
3/40
Address field LSBs and Address Counter Preset Inputs
Byte Write Enable for DQ
Byte Write Enable for DQ
Flow Through or Pipeline mode; active low
GS8322Z18(B/E)/GS8322Z36(B/E)/GS8322Z72(C)
Burst address counter advance enable
FLXDrive Output Impedance Control
Linear Burst Order mode; active low
Low = Low Impedance [High Drive],
High = High Impedance [Low Drive]
Sleep Mode control; active high
Clock Input Signal; active high
Data Input and Output pins
Output Enable; active low
Chip Enable; active high
Clock Enable; active low
Write Enable; active low
Chip Enable; active low
Chip Enable; active low
Must Connect High
Must Connect High
Must Connect Low
Description
Address Inputs
No Connect
E
, DQ
C
A
F
, DQ
, DQ
, DQ
G
B
D
, DQ
I/Os; active low
I/Os; active low
H
I/Os; active low
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