GC80960RD66 Intel, GC80960RD66 Datasheet - Page 3

• Manufacturer Part Number: GC80960RD66
• Manufacturer: Intel

Specifications of GC80960RD66

• Family Name: i960 RX
• Device Core: 80960
• Device Core Size: 32b
• Frequency (max): 66MHz
• Supply Voltage 1 (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Operating Temp Range: 0C to 95C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 352
• Package Type: HLBGA
• Lead Free Status / Rohs Status: Not Compliant

Contents
1.0
2.0
3.0
4.0
Datasheet
About This Document ................................................................................................................... 7
1.1
1.2
1.3
Functional Overview ..................................................................................................................... 9
2.1
2.2
Package Information ................................................................................................................... 17
3.1
3.2
3.3
Electrical Specifictions ...............................................................................................................44
4.1
4.2
4.3
4.4
Intel
Terminology .......................................................................................................................... 7
Additional Information Sources ............................................................................................. 8
Key Functional Units ........................................................................................................... 10
2.1.1
2.1.2
2.1.3
2.1.4
2.1.5
2.1.6
2.1.7
Intel
2.2.1
2.2.2
2.2.3
2.2.4
2.2.5
2.2.6
2.2.7
2.2.8
2.2.9
Package Introduction .......................................................................................................... 17
3.1.1
3.1.2
Package Thermal Specifications ........................................................................................ 40
3.2.1
3.2.2
Sources for Heatsinks and Accessories ............................................................................. 43
Absolute Maximum Ratings ................................................................................................ 44
V
Targeted DC Specifications ................................................................................................ 46
Targeted AC Specifications ................................................................................................ 48
4.4.1
4.4.2
4.4.3
CC5
®
®
Pin Requirements (V
Solutions960
i960
PCI-to-PCI Bridge Unit........................................................................................... 10
Private PCI Device Support ................................................................................... 10
DMA Controller ...................................................................................................... 10
Address Translation Unit ....................................................................................... 10
Messaging Unit ...................................................................................................... 10
Memory Controller .................................................................................................11
I
2.1.7.1
2.1.7.2
Burst Bus ...............................................................................................................13
Timer Unit .............................................................................................................. 13
Priority Interrupt Controller.....................................................................................13
Faults and Debugging............................................................................................14
On-Chip Cache and Data RAM ............................................................................. 14
Local Register Cache ............................................................................................14
Test Features......................................................................................................... 14
Memory-Mapped Control Registers .......................................................................15
Instructions, Data Types and Memory Addressing Modes .................................... 15
Functional Signal Definitions ................................................................................. 17
352-Lead HL-PBGA Package ................................................................................ 30
Thermal Specifications ..........................................................................................40
3.2.1.1
3.2.1.2
3.2.1.3
Thermal Analysis ................................................................................................... 42
Relative Output Timings ........................................................................................ 50
Memory Controller Relative Output Timings .......................................................... 50
Boundary Scan Test Signal Timings...................................................................... 52
2
C Bus Interface Unit ............................................................................................11
®
Core Features (Intel
I/O APIC Bus Interface Unit ................................................................... 11
Secondary PCI Arbitration Unit .............................................................. 11
Ambient Temperature ............................................................................ 40
Case Temperature ................................................................................. 40
Thermal Resistance ............................................................................... 41
®
Program ..............................................................................................7
DIFF
) ..........................................................................................45
®
80960JF) ...................................................................... 12
Intel
®
i960
®
RX I/O Processor at 3.3 Volts
Contents
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