GC80960RD66 Intel, GC80960RD66 Datasheet - Page 40

• Manufacturer Part Number: GC80960RD66
• Manufacturer: Intel

Specifications of GC80960RD66

• Family Name: i960 RX
• Device Core: 80960
• Device Core Size: 32b
• Frequency (max): 66MHz
• Supply Voltage 1 (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Operating Temp Range: 0C to 95C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 352
• Package Type: HLBGA
• Lead Free Status / Rohs Status: Not Compliant

Intel
Package Information
3.2
3.2.1
3.2.1.1
3.2.1.2
Figure 5.
40
®
i960
®
RX I/O Processor at 3.3 Volts
Package Thermal Specifications
The device is specified for operation when T
0° C to 95° C. Case temperature may be measured in any environment to determine
whether the processor is within specified operating range. Measure the case temperature
at the center of the top surface, opposite the ballpad.
Thermal Specifications
This section defines the terms used for thermal analysis.
Ambient Temperature
Ambient temperature, T
In a system environment, ambient temperature is the temperature of the air upstream
from the package.
Case Temperature
Thermocouple Attachment - No Heat Sink
•
•
•
•
•
•
To ensure functionality and reliability, the device is specified for proper operation when
the case temperature, T
Conditions” on page
When measuring case temperature, attention to detail is required to ensure accuracy. If a
thermocouple is used, calibrate it before taking measurements. Errors may result when the
measured surface temperature is affected by the surrounding ambient air temperature.
Such errors may be due to a poor thermal contact between thermocouple junction and the
surface, heat loss by radiation, or conduction through thermocouple leads.
To minimize measurement errors:
Use a 35 gauge K-type thermocouple or equivalent.
Attach the thermocouple bead or junction to the package top surface at a location
corresponding to the center of the die
accurate measurement and less variation as the boundary condition changes.
Attach the thermocouple bead or junction at a 90° angle by an adhesive bond (such
as thermal epoxy or heat-tolerant tape) to the package top surface as shown in
Figure
contact with the package above the center of the die. The hole diameter should be no
larger than 3.8 mm as shown in
5. When a heat sink is attached, drill a hole through the heat sink to allow
A
, is the temperature of the ambient air surrounding the package.
44.
Thermocouple Wire
C
, is within the specified range in
Epoxy Fillet
Figure
(Figure
6.
C
(case temperature) is within the range of
Thermocouple Bead
5). The center of the die gives a more
Table 16, “Operating
Datasheet