TE28F128J3D75 Micron Technology Inc, TE28F128J3D75 Datasheet - Page 13

• Manufacturer Part Number: TE28F128J3D75
• Manufacturer: Micron Technology Inc

Specifications of TE28F128J3D75

• Cell Type: NOR
• Density: 128Mb
• Access Time (max): 75ns
• Interface Type: Parallel
• Boot Type: Not Required
• Address Bus: 24/23Bit
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Program/erase Volt (typ): 2.7 to 3.6V
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8/16Bit
• Number Of Words: 16M/8M
• Mounting: Surface Mount
• Pin Count: 56
• Lead Free Status / Rohs Status: Not Compliant

Numonyx™ Embedded Flash Memory (J3 v. D)
Table 1:
3.2
Figure 5:
Table 2:
November 2007
308551-05
Lead Count
Lead Tip Angle
Seating Plane Coplanarity
Lead to Package Offset
Package Height (32, 64, 128- Mbit)
Package Height (256- Mbit)
Ball Height
Package Body Thickness (32, 64, 128- Mbit)
Parameter
Corner
Ball A1
56-Lead TSOP Dimension Table
Easy BGA Mechanical Specifications
Easy BGA Package Dimensions Table (Sheet 1 of 2)
A2
Easy BGA Package (32, 64, 128 and 256 Mbit)
Parameter
A
G
B
C
D
E
F
H
1
A1
2
Top View - Plastic Backside
Complete Ink Mark Not Shown
3
Symbol
4
D
N
q
Y
Z
5
6
7
A
A
A1
A2
Symb
ol
8
0.150
Min
0°
0.250
E
Min
Millimeters
A
A
G
0.250
B
C
D
E
F
H
Nom
56
3°
Seating
8
Plane
0.780
Nom
Millimeters
7
b
Bottom View - Ball Side Up
6
0.100
0.350
Max
1.200
1.300
5°
5
Max
4
3
Note
0.006
Min
s
0°
2
0.0098
1
Y
Min
S
1
Inches
0.010
Nom
e
56
3°
Ball A1
Corner
0.0307
S
Inches
2
Nom
Datasheet
0.004
0.014
0.0472
0.0512
Max
5°
Max
13