TE28F128J3D75 Micron Technology Inc, TE28F128J3D75 Datasheet - Page 68

• Manufacturer Part Number: TE28F128J3D75
• Manufacturer: Micron Technology Inc

Specifications of TE28F128J3D75

• Cell Type: NOR
• Density: 128Mb
• Access Time (max): 75ns
• Interface Type: Parallel
• Boot Type: Not Required
• Address Bus: 24/23Bit
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Program/erase Volt (typ): 2.7 to 3.6V
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8/16Bit
• Number Of Words: 16M/8M
• Mounting: Surface Mount
• Pin Count: 56
• Lead Free Status / Rohs Status: Not Compliant

Figure 31: Decoder for SCSP Family (256 Mbit Only)
Datasheet
68
Package Designator
RC = 64-Ball Easy BGA, leaded
PC = 64-Ball Easy BGA, lead-free
Group Designator
48F = Flash Memory only
Flash Density
0 = No die
3 = 128-Mbit
Product Family
J = Intel® Embedded Flash Memory
0 = No die
Table 45: Valid Line Item Combinations for SCSP Family
RC48F3300J0Z00S
PC48F3300J0Z00S
R
256-Mbit
C 4
8
F 3 3
0 0
J 0 Z 0
Numonyx™ Embedded Flash Memory (J3 v. D)
0
S
I/O Voltage, CE# Configuration
Z = 3.0 V, Individual Chip
Enable(s)
Parameter, Mux Configuration
0 = No boot Configuration
Ballout Designator
0 = Discrete ballout
Device Details
Third Generation – Character S
thru Z
November 2007
308551-05