MD3331-D64-V3-X SanDisk, MD3331-D64-V3-X Datasheet - Page 46

• Manufacturer Part Number: MD3331-D64-V3-X
• Manufacturer: SanDisk
• Type: Flash Diskr

Specifications of MD3331-D64-V3-X

• Density: 64MByte
• Operating Supply Voltage (typ): 3.3V
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Package Type: FBGA
• Mounting: Surface Mount
• Pin Count: 69
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.5V
• Operating Supply Voltage (max): 3.6V
• Programmable: Yes
• Lead Free Status / Rohs Status: Not Compliant

9.2
9.2.1
Mobile DiskOnChip Plus uses an SRAM-like interface that can easily be connected to any
microprocessor bus. With a standard interface, it requires 13 address lines, 8 data lines and basic
memory control signals (CE#, OE#, WE#), as shown in Figure 14 below. Typically, Mobile
DiskOnChip Plus can be mapped to any free 8KB memory space. In a PC compatible platform, it is
usually mapped into the BIOS expansion area. If the allocated memory window is larger than 8KB,
an automatic anti-aliasing mechanism prevents the firmware from being loaded more than once
during the ROM expansion search.
Notes: 1. The 0.1 µF and the 10 nF low-inductance high-frequency capacitors must be attached to
46
2.
3.
System Interface
Standard Interface
each of the device’s VCC and VSS balls. These capacitors must be placed as close as
possible to the package leads.
Mobile DiskOnChip Plus is an edge-sensitive device. CE#, OE# and WE# should be
properly terminated (according to board layout, serial parallel or both terminations) to
avoid signal ringing.
All capacities support the standard interface.
Output Enable
Write Enable
Chip Enable
Address
Chip ID
Reset
Data
0.1 uF
Figure 14: Standard System Interface
A[12:0]
D[15:0]
OE#
CE#
ID[1:0]
WE#
RSTIN#
10 nF
Mobile DiskOnChip
Data Sheet, Rev. 1.8
VCC
3.3 V
0.1 uF
Plus
VSS
IF_CFG
BUSY#
LOCK#
VCCQ
10 nF
BHE#
IRQ
1.8V/3.3V
1-20KOhm
Busy
Mobile DiskOnChip Plus 16/32MByte
95-SR-000-10-8L