ISP1362BD NXP Semiconductors, ISP1362BD Datasheet - Page 142

• Manufacturer Part Number: ISP1362BD
• Description: USB Interface IC USB OTG CONTROLLER
• Manufacturer: NXP Semiconductors

Specifications of ISP1362BD

• Operating Supply Voltage: 3 V to 3.6 V
• Lead Free Status / Rohs Status: Details
• Other names: ISP1362BD,157

NXP Semiconductors
ISP1362_5
Product data sheet
21.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 160. SnPb eutectic process (from J-STD-020C)
Table 161. Lead-free process (from J-STD-020C)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 160
and
Figure
161
41.
Rev. 05 — 8 May 2007
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
41) than a PbSn process, thus
Single-chip USB OTG Controller
220
220
350
> 2000
260
245
245
© NXP B.V. 2007. All rights reserved.
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