PIC18F1320-H/ML Microchip Technology, PIC18F1320-H/ML Datasheet - Page 288
PIC18F1320-H/ML
Manufacturer Part Number
PIC18F1320-H/ML
Description
IC MCU 8BIT 8KB FLASH 28QFN
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheet
1.PIC18F1220-ISO.pdf
(308 pages)
Specifications of PIC18F1320-H/ML
Core Processor
PIC
Core Size
8-Bit
Speed
25MHz
Connectivity
UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
16
Program Memory Size
8KB (4K x 16)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 7x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 150°C
Package / Case
28-VQFN Exposed Pad
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
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PIC18F1220/1320
24.2
The following sections give the technical details of the packages.
DS39605F-page 286
18-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
NOTE 1
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Package Details
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A1
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
N
1
2
b
b1
3
D
Dimension Limits
Units
e
A2
A1
E1
b1
eB
N
A
E
D
e
L
c
b
E1
A2
MIN
.115
.015
.300
.240
.880
.115
.008
.045
.014
–
–
L
.100 BSC
INCHES
NOM
.130
.310
.250
.900
.130
.010
.060
.018
18
–
–
–
Microchip Technology Drawing C04-007B
© 2007 Microchip Technology Inc.
E
eB
MAX
.210
.195
.325
.280
.920
.150
.014
.070
.022
.430
–
c
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