SC16IS741IPW,128 NXP Semiconductors, SC16IS741IPW,128 Datasheet - Page 27

• Manufacturer Part Number: SC16IS741IPW,128
• Description: IC UART 16TSSOP
• Manufacturer: NXP Semiconductors
• Type: IrDA or RS-232 or RS-485r

Specifications of SC16IS741IPW,128

• Number Of Channels: 1, UART
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Features: RS-485
• Fifo's: 64 Byte
• Protocol: RS232, RS485
• Voltage - Supply: 2.5V, 3.3V
• With Auto Flow Control: Yes
• With Irda Encoder/decoder: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Data Rate: 5 Mbps
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 2.3 V
• Supply Current: 6 mA
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Operating Supply Voltage: 2.5 V, 3.3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935290736128

NXP Semiconductors
8. Thermal characteristics
UJA1076_2
Product data sheet
Fig 13. HTSSOP PCB
Layout conditions for R
board, board dimensions 129 mm × 60 mm, board Material FR4, Cu thickness 0.070 mm, thermal
via separation 1.2 mm, thermal via diameter 0.3 mm ±0.08 mm, Cu thickness on vias 0.025 mm.
Optional heat sink top layer of 3.5 mm × 25 mm will reduce thermal resistance (see
PCB copper area:
(bottom layer)
2 cm
PCB copper area:
(bottom layer)
8 cm
2
2
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 27 May 2010
th(j-a)
measurements: board finish thickness 1.6 mm ±10 %, double-layer
High-speed CAN core system basis chip
optional heatsink top layer
optional heatsink top layer
optional heatsink top layer
UJA1076
© NXP B.V. 2010. All rights reserved.
015aaa137
Figure
14).
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