SC16C554IB64,151 NXP Semiconductors, SC16C554IB64,151 Datasheet - Page 51

• Manufacturer Part Number: SC16C554IB64,151
• Description: IC UART QUAD SOT314-2
• Manufacturer: NXP Semiconductors

Specifications of SC16C554IB64,151

• Number Of Channels: 4, QUART
• Fifo's: 16 Byte
• Voltage - Supply: 2.5V, 3.3V, 5V
• With Auto Flow Control: Yes
• With Irda Encoder/decoder: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• With Cmos: Yes
• Mounting Type: Surface Mount
• Package / Case: 64-LQFP
• Transmit Fifo: 16Byte
• Receive Fifo: 16Byte
• Transmitter And Receiver Fifo Counter: Yes
• Data Rate: 5Mbps
• Package Type: LQFP
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 4.5V
• Mounting: Surface Mount
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935270074151; SC16C554IB64-S; SC16C554IB64-S

Philips Semiconductors
13. Revision history
Table 29:
9397 750 11616
Product data
Rev Date
04
03
02
01
20030619
20030415
20030313
20020910
Revision history
CPCN
-
-
-
-
Description
Product data (9397 750 11616); ECN 853-2376 30028 of 16 June 2003.
Modifications:
Product data (9397 750 11375); ECN 853-2376 29797 of 11 April 2003.
Product data (9397 750 11002); ECN 853-2376 29627 of 10 March 2003.
Product data; (9397 750 09213); ECN 853-2376 28891 of 10 September 2002.
•
•
•
[3]
[4]
[5]
[6]
[7]
Figure 7 “Crystal oscillator connection.” on page
connection with resistor.
Table 26 “DC electrical characteristics” on page
Table 27 “AC electrical
strobe width’, and re-number subsequent note.
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217 C
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Quad UART with 16-byte FIFO and infrared (IrDA) encoder/decoder
Rev. 04 — 19 June 2003
characteristics”: add
Table note
35: I
18: revised capacitor’s values and added
10 C measured in the atmosphere of the reflow
CCsleep
SC16C554/554D
2, its reference to parameter ‘IOW
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
: change all values to 1 mA nom.
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