SAM9G10 Atmel Corporation, SAM9G10 Datasheet - Page 726

• Manufacturer Part Number: SAM9G10
• Manufacturer: Atmel Corporation

Specifications of SAM9G10

• Flash (kbytes): 0 Kbytes
• Pin Count: 217
• Max. Operating Frequency: 266 MHz
• Cpu: ARM926
• Hardware Qtouch Acquisition: No
• Max I/o Pins: 96
• Ext Interrupts: 96
• Usb Transceiver: 3
• Usb Speed: Full Speed
• Usb Interface: Host, Device
• Spi: 2
• Twi (i2c): 1
• Uart: 4
• Ssc: 3
• Sd / Emmc: 1
• Graphic Lcd: Yes
• Video Decoder: No
• Camera Interface: No
• Resistive Touch Screen: No
• Temp. Sensor: No
• Crypto Engine: No
• Sram (kbytes): 16
• Self Program Memory: NO
• External Bus Interface: 1
• Dram Memory: sdram
• Nand Interface: Yes
• Picopower: No
• Temp. Range (deg C): -40 to 85
• I/o Supply Class: 1.8/3.3
• Operating Voltage (vcc): 1.08 to 1.32
• Fpu: No
• Mpu / Mmu: No/Yes
• Timers: 3
• Output Compare Channels: 3
• Input Capture Channels: 3
• 32khz Rtc: Yes
• Calibrated Rc Oscillator: No

40. Mechanical Characteristics
40.1
Figure 40-1. 217-ball LFBGA Package Drawing
Table 40-1.
Table 40-2.
Table 40-3.
Table 40-4.
728
Ball Land
Solder Mask Opening
450
Moisture Sensitivity Level
JEDEC Drawing Reference
JESD97 Classification
Package Drawings
SAM9G10
Soldering Information (Substrate Level)
Device and 217-ball LFBGA Package Maximum Weight
217-ball LFBGA Package Characteristics
Package Reference
0.43 mm ± 0.05
0.30 mm ± 0.05
mg
3
MO-205
e1
6462B–ATARM–6-Sep-11