SAM9G20 Atmel Corporation, SAM9G20 Datasheet - Page 218

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SAM9G20

Manufacturer Part Number
SAM9G20
Description
Manufacturer
Atmel Corporation
Datasheets

Specifications of SAM9G20

Flash (kbytes)
0 Kbytes
Pin Count
217
Max. Operating Frequency
400 MHz
Cpu
ARM926
Hardware Qtouch Acquisition
No
Max I/o Pins
96
Ext Interrupts
96
Usb Transceiver
3
Usb Speed
Full Speed
Usb Interface
Host, Device
Spi
2
Twi (i2c)
1
Uart
7
Ssc
1
Ethernet
1
Sd / Emmc
1
Graphic Lcd
No
Video Decoder
No
Camera Interface
Yes
Adc Channels
4
Adc Resolution (bits)
10
Adc Speed (ksps)
95
Resistive Touch Screen
No
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
32
Self Program Memory
NO
External Bus Interface
1
Dram Memory
sdram
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
0.9 to 1.1
Fpu
No
Mpu / Mmu
No/Yes
Timers
6
Output Compare Channels
6
Input Capture Channels
6
32khz Rtc
Yes
Calibrated Rc Oscillator
No
22.6.4
Register Name:SDRAMC_LPR
Access Type:Read-write
Reset Value: 0x0
• LPCB: Low-power Configuration Bits
• PASR: Partial Array Self-refresh (only for low-power SDRAM)
PASR parameter is transmitted to the SDRAM during initialization to specify whether only one quarter, one half or all banks
of the SDRAM array are enabled. Disabled banks are not refreshed in self-refresh mode. This parameter must be set
according to the SDRAM device specification.
• TCSR: Temperature Compensated Self-Refresh (only for low-power SDRAM)
TCSR parameter is transmitted to the SDRAM during initialization to set the refresh interval during self-refresh mode
depending on the temperature of the low-power SDRAM. This parameter must be set according to the SDRAM device
specification.
• DS: Drive Strength (only for low-power SDRAM)
DS parameter is transmitted to the SDRAM during initialization to select the SDRAM strength of data output. This parame-
ter must be set according to the SDRAM device specification.
218
00
01
10
11
31
23
15
7
AT91SAM9G20
SDRAMC Low Power Register
Low Power Feature is inhibited: no Power-down, Self-refresh or Deep Power-down command is issued to the SDRAM
device.
The SDRAM Controller issues a Self-refresh command to the SDRAM device, the SDCLK clock is deactivated and the
SDCKE signal is set low. The SDRAM device leaves the Self Refresh Mode when accessed and enters it after the
access.
The SDRAM Controller issues a Power-down Command to the SDRAM device after each access, the SDCKE signal is
set to low. The SDRAM device leaves the Power-down Mode when accessed and enters it after the access.
The SDRAM Controller issues a Deep Power-down command to the SDRAM device. This mode is unique to low-
power SDRAM.
30
22
14
6
PASR
29
21
13
5
TIMEOUT
28
20
12
4
27
19
11
3
DS
26
18
10
2
25
17
9
1
6384E–ATARM–05-Feb-10
TCSR
LPCB
24
16
8
0

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