SAM9G45 Atmel Corporation, SAM9G45 Datasheet - Page 489

• Manufacturer Part Number: SAM9G45
• Manufacturer: Atmel Corporation

Specifications of SAM9G45

• Flash (kbytes): 0 Kbytes
• Pin Count: 324
• Max. Operating Frequency: 400 MHz
• Cpu: ARM926
• Hardware Qtouch Acquisition: No
• Max I/o Pins: 160
• Ext Interrupts: 160
• Usb Transceiver: 3
• Usb Speed: Hi-Speed
• Usb Interface: Host, Device
• Spi: 2
• Twi (i2c): 2
• Uart: 5
• Lin: 4
• Ssc: 2
• Ethernet: 1
• Sd / Emmc: 2
• Graphic Lcd: Yes
• Video Decoder: No
• Camera Interface: Yes
• Adc Channels: 8
• Adc Resolution (bits): 10
• Adc Speed (ksps): 440
• Resistive Touch Screen: Yes
• Temp. Sensor: No
• Crypto Engine: No
• Sram (kbytes): 64
• Self Program Memory: NO
• External Bus Interface: 2
• Dram Memory: DDR2/LPDDR, SDRAM/LPSDR
• Nand Interface: Yes
• Picopower: No
• Temp. Range (deg C): -40 to 85
• I/o Supply Class: 1.8/3.3
• Operating Voltage (vcc): 0.9 to 1.1
• Fpu: No
• Mpu / Mmu: No/Yes
• Timers: 6
• Output Compare Channels: 6
• Input Capture Channels: 6
• Pwm Channels: 4
• 32khz Rtc: Yes
• Calibrated Rc Oscillator: No

Figure 31-7. Multi-buffer with Linked Address for Source and Destination Buffers are Contiguous
11053B–ATARM–22-Sep-11
11053B–ATARM–22-Sep-11
Source Layer
Address of
The DMAC transfer flow is shown in
SADDR(3)
SADDR(2)
SADDR(1)
SADDR(0)
Source Buffers
Buffer 1
Buffer 2
Buffer 2
Buffer 0
Figure 31-8 on page
Buffer 1
Buffer 2
Buffer 2
Buffer 0
Destination Buffers
490.
DADDR(0)
DADDR(2)
DADDR(3)
DADDR(1)
Destination Layer
Address of
SAM9G35
SAM9G35
489
489