SAM9M11 Atmel Corporation, SAM9M11 Datasheet - Page 93
SAM9M11
Manufacturer Part Number
SAM9M11
Description
Manufacturer
Atmel Corporation
Specifications of SAM9M11
Flash (kbytes)
0 Kbytes
Pin Count
324
Max. Operating Frequency
400 MHz
Cpu
ARM926
Hardware Qtouch Acquisition
No
Max I/o Pins
160
Ext Interrupts
160
Usb Transceiver
3
Usb Speed
Hi-Speed
Usb Interface
Host, Device
Spi
2
Twi (i2c)
2
Uart
5
Lin
4
Ssc
2
Ethernet
1
Sd / Emmc
2
Graphic Lcd
Yes
Video Decoder
Yes
Camera Interface
Yes
Adc Channels
8
Adc Resolution (bits)
10
Adc Speed (ksps)
440
Resistive Touch Screen
Yes
Dac Resolution (bits)
No
Temp. Sensor
No
Crypto Engine
AES/DES
Sram (kbytes)
64
Self Program Memory
NO
External Bus Interface
2
Dram Memory
DDR2/LPDDR, SDRAM/LPSDR
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
0.9 to 1.1
Fpu
No
Mpu / Mmu
No / Yes
Timers
6
Output Compare Channels
6
Input Capture Channels
6
Pwm Channels
4
32khz Rtc
Yes
Calibrated Rc Oscillator
No
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ARM DDI 0029G
ARM7TDMI test chip or product
ARM7TDMI core
At the core level, TBE and DBE are inactive, tied HIGH, because in a packaged part
you do not have to manually force the internal buses into a high impedance state. At the
pad level, the test chip signal EDBE is used by the bus control logic to allow the external
memory controller to arbitrate the bus and asynchronously disable the ARM7TDMI
core test chip if necessary.
scan
scan
scan
cell
cell
cell
Note
Copyright © 1994-2001. All rights reserved.
MCLK
DBE
nENOUT
nENIN
TBE
D[31:0]
Vdd
Vdd
Vss
nEDBE
Figure 3-17 Test chip data bus circuit
nEN1
nEN2
Pad
Memory Interface
MCLK
EDBE
XD[31:0]
3-23
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