AD9444 Analog Devices, AD9444 Datasheet - Page 39

• Manufacturer Part Number: AD9444
• Description: 14-Bit, 80 MSPS A/D Converter
• Manufacturer: Analog Devices

Specifications of AD9444

• Resolution (bits): 14bit
• # Chan: 1
• Sample Rate: 80MSPS
• Interface: Par
• Analog Input Type: Diff-Uni
• Ain Range: (2Vref) p-p,1 V p-p,2 V p-p
• Adc Architecture: Pipelined
• Pkg Type: QFP

OUTLINE DIMENSIONS
ORDERING GUIDE
Model
AD9444BSVZ-80
AD9444-CMOS/PCB
AD9444-LVDS/PCB
1
Z = Pb-free part.
1
NOTES
1. CENTER FIGURES ARE TYPICAL UNLESS OTHERWISE NOTED.
2. THE PACKAGE HAS A CONDUCTIVE HEAT SLUG TO HELP DISSIPATE HEAT AND ENSURE RELIABLE OPERATION OF
3. THE EXPOSED HEAT SINK SOLDERED TO THE GROUND PLANE IS REQUIRED FOR THE 100-LEAD TQFP/EP.
THE DEVICE OVER THE FULL INDUSTRIAL TEMPERATURE RANGE. THE SLUG IS EXPOSED ON THE BOTTOM OF
THE PACKAGE AND ELECTRICALLY CONNECTED TO CHIP GROUND. IT IS RECOMMENDED THAT NO PCB SIGNAL
TRACES OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIVE
SLUG. ATTACHING THE SLUG TO A GROUND PLANE WILL REDUCE THE JUNCTION TEMPERATURE OF THE
DEVICE WHICH MAY BE BENEFICIAL IN HIGH TEMPERATURE ENVIRONMENTS.
SEATING
PLANE
0.75
0.60
0.45
0.20
0.09
Temperature Range
–40°C to +85°C
MAX
1.20
3.5°
7°
0°
Figure 70. 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
25
1
100
26
0.50 BSC
COMPLIANT TO JEDEC STANDARDS MS-026AED-HD
(PINS DOWN)
16.00 SQ
TOP VIEW
14.00 SQ
Dimensions shown in millimeters
0.27
0.22
0.17
Rev. 0 | Page 39 of 40
Package Description
100-Lead TQFP_EP
CMOS Mode Evaluation Board
LVDS Mode Evaluation Board
(SV-100-1)
0.15
0.05
50
76
75
51
1.05
1.00
0.95
COPLANARITY
0.08
75
51
50
76
BOTTOM VIEW
CONDUCTIVE
HEAT SINK
(PINS UP)
NOM
6.50
100
26
1
25
Package Outline
SV-100-1
AD9444