AD7714 Analog Devices, AD7714 Datasheet - Page 40

• Manufacturer Part Number: AD7714
• Manufacturer: Analog Devices

Specifications of AD7714

• Resolution (bits): 24bit
• # Chan: 5
• Sample Rate: 19.2kSPS
• Interface: Ser,SPI
• Analog Input Type: Diff-Bip,Diff-Uni
• Ain Range: (2Vref/PGA Gain) p-p,Uni (Vref)/(PGA Gain)
• Adc Architecture: Sigma-Delta
• Pkg Type: DIP,SOIC,SOP

AD7714
0.01 (0.254)
0.006 (0.15)
0.019 (0.41)
NOTES:
1. LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH
2. PLASTIC LEADS WILL BE EITHER SOLDER DIPPED OR TIN PLATED
0.02 (0.5)
NOTES:
1. LEAD NO. 1 IDENTIFIED BY DOT.
2. SOIC LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
24
24
1
1
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
PIN 1
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
PIN 1
0.05 (1.27)
BSC
0.608 (15.45)
0.596 (15.13)
1.228 (31.19)
1.226 (31.14)
0.016 (2.28)
0.11 (2.79)
24-Lead Wide Body SOIC
0.019 (0.49)
0.014 (0.35)
24-Lead Plastic DIP
0.07 (1.78)
0.05 (1.27)
(R-24)
(N-24)
13
12
0.096 (204)
0.089 (2.26)
SEATING
PLANE
13
12
0.291 (7.39)
0.299 (7.6)
0.260 ± 0.001
(6.61 ± 0.03)
SEATING
PLANE
0.130 (3.30)
0.128 (7.62)
0.013 (0.32)
0.009 (0.23)
0.414 (10.52)
0.398 (10.10)
15
0
0.32 (8.128)
8
0
0.30 (7.62)
Dimensions are shown in inches and (mm).
0.03 (0.76)
0.02 (0.51)
0.011 (0.28)
0.009 (0.23)
OUTLINE DIMENSIONS
0.0500 (1.27)
0.0157 (0.40)
–40–
0.008 (0.203)
0.002 (0.050)
0.006 (0.15)
0.002 (0.05)
SEATING
24-Lead Thin Shrink Small Outline Package TSSOP
PLANE
28
NOTES:
1. LEAD NO. 1 IDENTIFIED BY DOT.
2. LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
1
28-Lead Shrink Small Outline Package SSOP
PIN 1
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
24
1
0.0256 (0.65)
PIN 1
BSC
0.0256 (0.65)
0.407 (10.34)
0.397 (10.08)
0.311 (7.90)
0.303 (7.70)
BSC
0.0118 (0.30)
0.0075 (0.19)
SEATING
(RU-24)
(RS-28)
PLANE
13
12
0.066 (1.67)
0.07 (1.79)
14
15
0.0433
(1.10)
MAX
0.205 (5.207)
0.009 (0.229)
0.005 (0.127)
0.212 (5.38)
0.0035 (0.090)
0.0079 (0.20)
0.301 (7.64)
0.311 (7.9)
8
0
8
0
0.022 (0.558)
0.03 (0.762)
0.028 (0.70)
0.020 (0.50)
REV. C