AD5541A Analog Devices, AD5541A Datasheet - Page 8
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AD5541A
Manufacturer Part Number
AD5541A
Description
Manufacturer
Analog Devices
Datasheet
1.AD5541A.pdf
(20 pages)
Specifications of AD5541A
Resolution (bits)
16bit
Dac Update Rate
1MSPS
Dac Settling Time
1µs
Max Pos Supply (v)
+5.5V
Single-supply
Yes
Dac Type
Unbuffered Vout
Dac Input Format
Ser,SPI
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AD5541A
Table 7. AD5541A-1 and AD5541A Pin Function Descriptions
8-Lead LFCSP
1
2
3
4
5
6
N/A
7
8
N/A
N/A
N/A
1
N/A means not applicable.
1
1
1
1
Figure 5. AD5541A-1 8-Lead LFCSP Pin Configuration
NOTES
1. FOR INCREASED RELIABILITY OF THE SOLDER
TO THE SUBSTRATE, GND.
JOINTS AND MAXIMUM THERMAL CAPABILITY,
IT IS RECOMMENDED THAT THE PAD BE SOLDERED
Pin No.
SCLK
10-Lead LFCSP
4
5
6
7
N/A
2
9
1
N/A
3
10
8
REF
DIN
CS
1
1
1
2
3
4
AD5541A-1
(Not to Scale)
TOP VIEW
Mnemonic
REF
CS
SCLK
DIN
CLR
V
DGND
V
GND
AGND
V
LDAC
EPAD
OUT
DD
LOGIC
8 GND
7 V
6 V
5 CLR
DD
OUT
Description
Voltage Reference Input for the DAC. Connect to an external 2.5 V reference. The
reference can range from 2 V to V
Logic Input Signal. The chip select signal is used to frame the serial data input.
Clock Input. Data is clocked into the serial input register on the rising edge of SCLK.
Duty cycle must be between 40% and 60%.
Serial Data Input. This device accepts 16-bit words. Data is clocked into the serial input
register on the rising edge of SCLK.
Asynchronous Clear Input. The CLR input is falling edge sensitive. When CLR is low, all
LDAC pulses are ignored. When CLR is activated, the serial input register and the DAC
register are cleared to zero scale.
Analog Output Voltage from the DAC.
Digital Ground. Ground reference for digital circuitry.
Analog Supply Voltage.
Ground Reference Point for Both Analog and Digital Circuitry.
Ground Reference Point for Analog Circuitry.
Logic Power Supply.
LDAC Input. When this input is taken low, the DAC register is simultaneously updated
with the contents of the serial input register.
Exposed Pad. For increased reliability of the solder joints and maximum thermal
capability, it is recommended that the pad be soldered to the substrate, GND.
Rev. A | Page 8 of 20
NOTES
1. FOR INCREASED RELIABILITY OF THE SOLDER
Figure 6. AD5541A 10-Lead LFCSP Pin Configuration
DD
JOINTS AND MAXIMUM THERMAL CAPABILITY,
IT IS RECOMMENDED THAT THE PAD BE SOLDERED
TO THE SUBSTRATE, GND.
.
AGND
V
REF
V
OUT
CS
DD
1
2
3
4
5
(Not to Scale)
AD5541A
TOP VIEW
10 V
9
8
7
6
LDAC
DGND
DIN
SCLK
LOGIC