AD5626 Analog Devices, AD5626 Datasheet - Page 17

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AD5626

Manufacturer Part Number
AD5626
Description
Manufacturer
Analog Devices
Datasheet

Specifications of AD5626

Resolution (bits)
12bit
Dac Update Rate
2MSPS
Dac Settling Time
16µs
Max Pos Supply (v)
+5.25V
Single-supply
Yes
Dac Type
Voltage Out
Dac Input Format
Ser,SPI

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AD5626BCPZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Part Number:
AD5626BCPZ-REEL7
Manufacturer:
ADI
Quantity:
765
Part Number:
AD5626BRMZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Part Number:
AD5626BRMZ-REEL7
Manufacturer:
ADI/亚德诺
Quantity:
20 000
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
AD5626BRMZ
AD5626BRMZ-REEL7
AD5626BCPZ-REEL7
1
Z = RoHS Compliant Part.
1
1
1
PIN 1 INDEX
INL (LSB)
±1
±1
±1
SEATING
PLANE
AREA
0.80
0.75
0.70
0.95
0.85
0.75
Figure 37. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
0.15
0.00
COPLANARITY
3.20
3.00
2.80
PIN 1
Figure 36. 8-Lead Mini Small Outline Package [MSOP]
TOP VIEW
BSC SQ
3.00
0.10
3 mm x 3 mm Body, Very Very Thin, Dual Lead
COMPLIANT TO JEDEC STANDARDS MO-187-AA
0.38
0.22
0.80 MAX
0.55 NOM
8
1
0.65 BSC
3.20
3.00
2.80
Dimensions shown in millimeters
Dimensions shown in millimeters
5
4
SEATING
PLANE
Rev. A | Page 17 of 20
5.15
4.90
4.65
1.10 MAX
0.20 REF
(CP-8-3)
(RM-8)
0.50
0.40
0.30
0.05 MAX
0.02 NOM
0.23
0.08
0.30
0.23
0.18
Package Description
8-Lead MSOP
8-Lead MSOP
8-Lead LFCSP_WD
5
4
(BOTTOM VIEW)
EXPOSED
2.48
2.38
2.23
PAD
1
8
0.65 BSC
0.80
0.60
0.40
1.74
1.64
1.49
Package Option
RM-8
RM-8
CP-8-3
Branding
DAP
DAP
DAP
AD5626

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