AD7397 Analog Devices, AD7397 Datasheet - Page 5

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AD7397

Manufacturer Part Number
AD7397
Description
Dual Parallel-Input 10-Bit DAC
Manufacturer
Analog Devices
Datasheet

Specifications of AD7397

Resolution (bits)
10bit
Dac Update Rate
17kSPS
Dac Settling Time
60µs
Max Pos Supply (v)
+5.5V
Single-supply
Yes
Dac Type
Voltage Out
Dac Input Format
Par

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AD7397AN
Manufacturer:
Analog Devices Inc.
Quantity:
10
Part Number:
AD7397ARUZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Part Number:
AD7397ARZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
REV. 0
ABSOLUTE MAXIMUM RATINGS*
V
V
Logic Inputs to GND . . . . . . . . . . . . . . . . . . . . . –0.3 V, +8 V
V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +2 V
I
Package Power Dissipation . . . . . . . . . . . . . (T
Thermal Resistance
Model
AD7396AN
AD7396AR
AD7397AN
AD7397AR
AD7397ARU
The AD7396/AD7397 contains 1365 transistors. The die size measures 89 mil
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7396/AD7397 features proprietary ESD protection circuitry, permanent dam-
age may occur on devices subjected to high energy electrostatic discharges. Therefore, proper
ESD precautions are recommended to avoid performance degradation or loss of functionality.
OUT
DD
REF
OUT
24-Lead Plastic DIP Package (N-24) . . . . . . . . . . +63 C/W
24-Lead SOIC Package (R-24) . . . . . . . . . . . . . . . +70 C/W
24-Lead Thin Shrink Surface Mount (RU-24) . . +143 C/W
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +8 V
Short Circuit to GND . . . . . . . . . . . . . . . . . . . . +50 mA
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, V
to GND . . . . . . . . . . . . . . . . . . . . . –0.3 V, V
Res
(LSB)
12
12
10
10
10
JA
–40 C to +85 C
–40 C to +85 C
–40 C to +125 C
–40 C to +125 C
–40 C to +85 C
Temperature
Ranges
J
max – T
DD
+ 0.3 V
ORDERING GUIDE
A
)/
DD
Package
Descriptions
24-Lead P-DIP
24-Lead SOIC
24-Lead P-DIP
24-Lead SOIC
24-Lead Thin Shrink Small Outline Package (TSSOP)
JA
–5–
106 mil = 9434 sq mil.
Maximum Junction Temperature (T
Operating Temperature Range . . . . . . . . . . . –40 C to +85 C
Storage Temperature Range . . . . . . . . . . . . –65 C to +150 C
Lead Temperature
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
N-24 (Soldering, 10 sec) . . . . . . . . . . . . . . . . . . . . . . +300 C
R-24 (Vapor Phase, 60 sec) . . . . . . . . . . . . . . . . . . . . +215 C
RU-24 (Infrared, 15 sec) . . . . . . . . . . . . . . . . . . . . . . +224 C
AD7397AN, AD7397AR Only . . . . . . . . –40 C to +125 C
AD7396/AD7397
WARNING!
J
max) . . . . . . . . . +150 C
ESD SENSITIVE DEVICE
Package
Options
N-24
R-24
N-24
R-24
RU-24

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