OP727 Analog Devices, OP727 Datasheet - Page 4

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OP727

Manufacturer Part Number
OP727
Description
Precision Rail-to-Rail Output Single Supply Dual Op Amp
Manufacturer
Analog Devices
Datasheet

Specifications of OP727

-3db Bandwidth
700kHz
Slew Rate
200mV/µs
Vos
30µV
Ib
5.5nA
# Opamps Per Pkg
2
Input Noise (nv/rthz)
15nV/rtHz
Vcc-vee
3V to 36V
Isy Per Amplifier
290µA
Packages
SOIC,SOP

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Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 V
Input Voltage . . . . . . . . . . . . . . . . . . . . –V
Differential Input Voltage . . . . . . . . . . . . . .
Output Short-Circuit Duration to GND . . . . . . . . . Indefinite
Storage Temperature Range
Operating Temperature Range
Junction Temperature Range
Lead Temperature Range (Soldering, 60 sec) . . . . . . . 300 C
Electrostatic Discharge (Human Body Model) . . . . 2000 V max
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the OP777/OP727/OP747 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
RM, R, RU Packages . . . . . . . . . . . . . . . . –65 C to +150 C
OP777/OP727/OP747 . . . . . . . . . . . . . . . –40 C to +85 C
RM, R, RU Packages . . . . . . . . . . . . . . . . –65 C to +150 C
S
– 5 V to +V
Supply Voltage
S
+ 5 V
–4–
8-Lead MSOP (RM)
8-Lead SOIC (R)
8-Lead TSSOP (RU)
14-Lead SOIC (R)
14-Lead TSSOP (RU)
NOTES
1
2
3
Absolute maximum ratings apply at 25 C, unless otherwise noted.
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
circuit board for surface-mount packages.
JA
is specified for worst-case conditions, i.e.,
190
158
240
120
180
JA
is specified for device soldered in
35
44
43
43
36
ESD SENSITIVE DEVICE
C/W
C/W
C/W
C/W
C/W
REV.
D

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