ADP5065 Analog Devices, ADP5065 Datasheet - Page 38

• Manufacturer Part Number: ADP5065
• Description: Fast Charge Battery Management with Power Path and USB Compatibility
• Manufacturer: Analog Devices

Specifications of ADP5065

• Product Description: Fast Charge Battery Management with Power Path and USB Compatibility
• Switching/linear: Switching
• Cell Type: Li-Ion
• Final Voltage Options: 4.2
• Accuracy Over Temp (%): 0.3%
• Temp Range: -40 to +125°C
• Package: WLCSP-20
• Active For Param Search: Yes

ADP5065
JUNCTION TEMPERATURE
In cases where the ambient temperature, T
thermal resistance parameter, θ
junction temperature rise. T
the formula
The typical θ
Table 5). A very important factor to consider is that θ
on a 4-layer, 4 in × 3 in, 2.5 oz copper board as per JEDEC
standard, and real applications may use different sizes and
layers. It is important to maximize the copper to remove the heat
from the device. Copper exposed to air dissipates heat better
than copper used in the inner layers.
When designing an application for a particular ambient
temperature range, calculate the expected
dissipation (P
temperature, T
T
J
= T
A
+ ( P
JA
D
). From this power calculation, the junction
value for the 20-bump WLCSP is 46.8°C/W (see
J
, can be estimated using Equation 9.
D
× θ
JA
)
J
is calculated from T
JA
, can be used to estimate the
ADP5065
A
, is known, the
A
and P
power
JA
is based
D
using
Rev. A | Page 38 of 40
(9)
Maximum junction temperature (T
from the board temperature (T
using the formula
where θ
The typical value for the 20-bump WLCSP is 9.2°C/W (see
Table 5). θ
board, as per the JEDEC standard.
For a WLCSP device, where possible, remove heat from every
current carrying bump (PGNDx, VINx, SWx, ISO_Sx, and
ISO_Bx). For example, thermal vias to the board power planes
can be placed close to these pins, where available.
The reliable operation of the charger can be achieved only if the
estimated die junction temperature of the
is less than 125°C. Reliability and mean time between failures
(MTBF) are highly affected by increasing the junction temper-
ature. Additional information about product reliability is
available in the ADI Reliability Handbook at the following URL:
www.analog.com/reliability_handbook
T
J
= T
JB
is the junction-to-board thermal resistance.
JB
A
is based on a 4-layer, 4 in × 3 in, 2.5 oz copper
+ ( P
D
× θ
JB
)
B
) and power dissipation (P
J
) can also be calculated
.
ADP5065
Data Sheet
(Equation 9)
D
)
(10)