ADUC7024 Analog Devices, ADUC7024 Datasheet - Page 93
![no-image](/images/manufacturer_photos/0/0/56/analog_devices_sml.jpg)
ADUC7024
Manufacturer Part Number
ADUC7024
Description
Manufacturer
Analog Devices
Datasheet
1.ADUC7029.pdf
(96 pages)
Specifications of ADUC7024
Mcu Core
ARM7 TDMI
Mcu Speed (mips)
40
Sram (bytes)
8192Bytes
Gpio Pins
30
Adc # Channels
10
Other
PWM
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Company
Part Number
Manufacturer
Quantity
Price
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* 1.40 MAX
1.45
1.40
1.35
ROTATED 90° CCW
0.15
0.05
1.50
SQ
VIEW A
SEATING
PLANE
DETAIL A
TOP VIEW
Figure 89. 64-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
6.10
6.00 SQ
5.90
0.08
COPLANARITY
BALL A1
PAD CORNER
Figure 88. 80-Lead Low Profile Quad Flat Package [LQFP]
0.20
0.09
COMPLIANT TO JEDEC STANDARDS MS-026-BDD
3.5°
7°
0°
* COMPLIANT TO JEDEC STANDARDS MO-225
WITH THE EXCEPTION TO PACKAGE HEIGHT.
0.75
0.60
0.45
Dimensions shown in millimeters
Dimensions shown in millimeters
Rev. D | Page 93 of 96
4.55 SQ
0.15 MIN
1.60
MAX
(BC-64-4)
(ST-80-1)
BALL DIAMETER
0.65
VIEW A
20
1
80
8
21
LEAD PITCH
ADuC7019/20/21/22/24/25/26/27/28/29
0.45
0.40
0.35
7
BOTTOM VIEW
BSC
DETAIL A
PIN 1
0.50
6
(PINS DOWN)
TOP VIEW
5
14.20
14.00 SQ
13.80
INDEX AREA
4
A1 CORNER
3
2
0.27
0.22
0.17
SEATING
PLANE
1
B
D
E
F
H
61
40
A
C
G
0.65 MIN
60
41
COPLANARITY
0.10
12.20
12.00 SQ
11.80