ST72521AR9 STMicroelectronics, ST72521AR9 Datasheet - Page 200
ST72521AR9
Manufacturer Part Number
ST72521AR9
Description
8-BIT MCU WITH NESTED INTERRUPTS, FLASH, 10-BIT ADC, FIVE TIMERS, SPI, SCI, I2C, CAN INTERFACE
Manufacturer
STMicroelectronics
Datasheet
1.ST72521AR9.pdf
(215 pages)
Specifications of ST72521AR9
Hdflash Endurance
100 cycles, data retention
Clock Sources
crystal/ceramic resonator oscillators, internal RC oscillator and bypass for external clock
Four Power Saving Modes
Halt, Active-Halt, Wait and Slow
Main Clock Controller With
Real time base, Beep and Clock-out capabilities
Two 16-bit Timers With
2 input captures, 2 output compares, external clock input on one timer, PWM and pulse generator modes
8-bit Pwm Auto-reload Timer With
2 input captures, 4 PWM outputs, output compare and time base interrupt, external clock with event detector
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ST72F521, ST72521B
13.3 SOLDERING INFORMATION
In accordance with the RoHS European directive,
all STMicroelectronics packages will be converted
in 2005 to lead-free technology, named ECO-
PACK
PCN CRP/04/744 "Lead-free Conversion Program
- Compliance with RoHS", issued November 18th,
2004).
■
■
Table 29. Soldering Compatibility (wave and reflow soldering process)
* Assemblers must verify that the Pb-package maximum temperature (mentioned on the Inner box label)
is compatible with their Lead-free soldering process.
200/215
TQFP
ECOPACK
to the JEDEC STD-020B compliant soldering
profile.
Detailed information on the STMicroelectronic
ECOPACK
www.st.com/stonline/leadfree/,
technical Application notes covering the main
technical
conversion
AN2036).
Package
TM
(for a detailed roadmap, please refer to
TM
TM
aspects
(AN2033,
packages are qualified according
transition program is available on
NiPdAu (Nickel-palladium-Gold)
related
Plating material devices
AN2034,
with
to
lead-free
AN2035,
specific
Backward and forward compatibility:
The main difference between Pb and Pb-free sol-
dering process is the temperature range.
– ECOPACK
– TQFP Pb-packages are compatible with Lead-
ible with Lead (Pb) containing soldering process
(see application note AN2034)
free soldering process, nevertheless it's the cus-
tomer's duty to verify that the Pb-packages max-
imum temperature (mentioned on the Inner box
label) is compatible with their Lead-free soldering
temperature.
Pb solder paste
Yes
TM
TQFP packages are fully compat-
Pb-free solder paste
Yes *
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