STR751FR2 STMicroelectronics, STR751FR2 Datasheet - Page 79
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STR751FR2
Manufacturer Part Number
STR751FR2
Description
ARM7TDMI-S™ 32-BIT MCU with Flash, SMI, 3 std 16-bit timers, PWM timer, fast 10-bit ADC, I2C, UART, SSP, USB and CAN
Manufacturer
STMicroelectronics
Datasheet
1.STR755FV2.pdf
(84 pages)
Specifications of STR751FR2
Smart Low Power Modes
SLOW, WFI, STOP and STANDBY with backup registers
Conversion Time
min. 3.75 μs
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STR750Fxx STR751Fxx STR752Fxx STR755Fxx
7.2
7.2.1
Thermal characteristics
The maximum chip junction temperature (T
Table 10: General operating conditions on page
The maximum chip-junction temperature, T
using the following equation:
Where:
Table 48.
1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org
environment.
Symbol
–
–
–
–
–
Θ
Θ
Θ
Θ
JA
JA
JA
JA
T
Θ
P
P
chip internal power.
P
Where:
P
taking into account the actual V
level in the application.
Amax
Dmax
INTmax
I/Omax
I/Omax
JA
Thermal characteristics
is the Package Junction-to-Ambient Thermal Resistance, in ° C/W,
Thermal Resistance Junction-Ambient
LQFP 100 - 14 x 14 mm / 0.5 mm pitch
Thermal Resistance Junction-Ambient
LQFP 64 - 10 x 10 mm / 0.5 mm pitch
Thermal Resistance Junction-Ambient
LFBGA 64 - 8 x 8 x 1.7mm
Thermal Resistance Junction-Ambient
LFBGA 100 - 10 x 10 x 1.7mm
is the maximum Ambient Temperature in °C,
is the sum of P
= Σ (V
represents the maximum Power Dissipation on Output Pins.
is the product of I
OL
*I
OL
) + Σ((V
T
INTmax
Jmax
Parameter
DD
= T
DD
(1)
and P
and V
Amax
-V
OL
OH
Jmax
Jmax
/ I
I/Omax
DD
)*I
+ (P
OL
, expressed in Watts. This is the maximum
OH
) must never exceed the values given in
, in degrees Celsius, may be calculated
34.
and V
Dmax
),
(P
Dmax
OH
x Θ
/ I
JA
= P
OH
)
INTmax
of the I/Os at low and high
Package characteristics
+ P
Value
46
45
58
41
I/Omax
),
°C/W
°C/W
°C/W
°C/W
Unit
79/84