NC7SZ125P5 Fairchild Semiconductor, NC7SZ125P5 Datasheet - Page 9

IC BUFF TRI-ST UHS N-INV SC705

NC7SZ125P5

Manufacturer Part Number
NC7SZ125P5
Description
IC BUFF TRI-ST UHS N-INV SC705
Manufacturer
Fairchild Semiconductor
Series
7SZr
Datasheet

Specifications of NC7SZ125P5

Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
1
Number Of Bits Per Element
1
Current - Output High, Low
32mA, 32mA
Voltage - Supply
1.65 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
SC-70-5, SC-88A, SOT-323-5, SOT-353, 5-TSSOP
Logic Family
TinyLogic UHS
Number Of Channels Per Chip
1
Polarity
Non-Inverting
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.65 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
High Level Output Current
- 32 mA
Low Level Output Current
32 mA
Maximum Power Dissipation
150 mW
Minimum Operating Temperature
- 40 C
Number Of Lines (input / Output)
1 / 1
Output Type
3-State
Propagation Delay Time
5.7 ns at 3.3 V, 5 ns at 5 V
Logic Device Type
Buffer, Non Inverting
Supply Voltage Range
1.65V To 5.5V
Logic Case Style
SC-70
No. Of Pins
5
Operating Temperature Range
-40°C To +85°C
Filter Terminals
SMD
Rohs Compliant
Yes
Family Type
7SZ
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
NC7SZ125P5TR

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© 1996 Fairchild Semiconductor Corporation
NC7SZ125 • Rev. 1.0.4
Physical Dimensions
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
Tape and Reel Specifications
Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications:
http://www.fairchildsemi.com/packaging/MicroPAK2_6L_tr.pdf.
Package Designator
FHX
5X
DETAIL A
PIN 1
MIN 250uM
(0.08) 4X
2X
A. COMPLIES TO JEDEC MO-252 STANDARD
C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994
D. LANDPATTERN RECOMMENDATION IS BASED ON FSC
E. DRAWING FILENAME AND REVISION: MGF06AREV3
NOTES:
B. DIMENSIONS ARE IN MILLIMETERS.
0.35
0.25
DESIGN.
0.05 C
C
0.35
Figure 10. 6-Lead, MicroPak2, 1x1mm Body, .35mm Pitch
1
6
Leader (Start End)
BOTTOM VIEW
Trailer (Hub End)
TOP VIEW
SIDE VIEW
Tape Section
1.00
2
5
Carrier
3
4
0.60
0.55MAX
B
(0.08)
4X
0.09
0.19
1.00
A
0.05 C
6X
2X
Cavity Number
.05 C
125 (Typical)
0.10
75 (Typical)
9
0.05 C
5000
C B A
5X
1X
5X 0.40
CHAMFER
1X 0.45
0.075X45°
0.52
0.57
RECOMMENDED LAND PATTERN
FOR SPACE CONSTRAINED PCB
ALTERNATIVE LAND PATTERN
FOR UNIVERSAL APPLICATION
Cavity Status Cover Type Status
(0.05) 6X
DETAIL A
PIN 1 LEAD SCALE: 2X
0.90
Empty
Empty
0.89
0.20 6X
Filled
6X 0.19
0.35
0.35
0.73
0.66
0.40
0.30
Sealed
Sealed
Sealed
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