NC7SZ125P5 Fairchild Semiconductor, NC7SZ125P5 Datasheet - Page 9

• Manufacturer Part Number: NC7SZ125P5
• Description: IC BUFF TRI-ST UHS N-INV SC705
• Manufacturer: Fairchild Semiconductor
• Series: 7SZr

Specifications of NC7SZ125P5

• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 1
• Number Of Bits Per Element: 1
• Current - Output High, Low: 32mA, 32mA
• Voltage - Supply: 1.65 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: SC-70-5, SC-88A, SOT-323-5, SOT-353, 5-TSSOP
• Logic Family: TinyLogic UHS
• Number Of Channels Per Chip: 1
• Polarity: Non-Inverting
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.65 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• High Level Output Current: - 32 mA
• Low Level Output Current: 32 mA
• Maximum Power Dissipation: 150 mW
• Minimum Operating Temperature: - 40 C
• Number Of Lines (input / Output): 1 / 1
• Output Type: 3-State
• Propagation Delay Time: 5.7 ns at 3.3 V, 5 ns at 5 V
• Logic Device Type: Buffer, Non Inverting
• Supply Voltage Range: 1.65V To 5.5V
• Logic Case Style: SC-70
• No. Of Pins: 5
• Operating Temperature Range: -40°C To +85°C
• Filter Terminals: SMD
• Rohs Compliant: Yes
• Family Type: 7SZ
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: NC7SZ125P5TR

© 1996 Fairchild Semiconductor Corporation
NC7SZ125 • Rev. 1.0.4
Physical Dimensions
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
Tape and Reel Specifications
Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications:
http://www.fairchildsemi.com/packaging/MicroPAK2_6L_tr.pdf.
Package Designator
FHX
5X
DETAIL A
PIN 1
MIN 250uM
(0.08) 4X
2X
A. COMPLIES TO JEDEC MO-252 STANDARD
C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994
D. LANDPATTERN RECOMMENDATION IS BASED ON FSC
E. DRAWING FILENAME AND REVISION: MGF06AREV3
NOTES:
B. DIMENSIONS ARE IN MILLIMETERS.
0.35
0.25
DESIGN.
0.05 C
C
0.35
Figure 10. 6-Lead, MicroPak2, 1x1mm Body, .35mm Pitch
1
6
Leader (Start End)
BOTTOM VIEW
Trailer (Hub End)
TOP VIEW
SIDE VIEW
Tape Section
1.00
2
5
Carrier
3
4
0.60
0.55MAX
B
(0.08)
4X
0.09
0.19
1.00
A
0.05 C
6X
2X
Cavity Number
.05 C
125 (Typical)
0.10
75 (Typical)
9
0.05 C
5000
C B A
5X
1X
5X 0.40
CHAMFER
1X 0.45
0.075X45°
0.52
0.57
RECOMMENDED LAND PATTERN
FOR SPACE CONSTRAINED PCB
ALTERNATIVE LAND PATTERN
FOR UNIVERSAL APPLICATION
Cavity Status Cover Type Status
(0.05) 6X
DETAIL A
PIN 1 LEAD SCALE: 2X
0.90
Empty
Empty
0.89
0.20 6X
Filled
6X 0.19
0.35
0.35
0.73
0.66
0.40
0.30
Sealed
Sealed
Sealed
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