ADP5034-1-EVALZ Analog Devices, ADP5034-1-EVALZ Datasheet - Page 6
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ADP5034-1-EVALZ
Manufacturer Part Number
ADP5034-1-EVALZ
Description
Manufacturer
Analog Devices
Datasheet
1.ADP5034-1-EVALZ.pdf
(28 pages)
ADP5034
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
AVIN, VIN1, VIN2, VIN3, VIN4, VOUT1,
SW1, SW2
VIN1, VIN2 to AVIN
Storage Temperature Range
Operating Junction Temperature
Soldering Conditions
ESD Human Body Model
ESD Charged Device Model
ESD Machine Model
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
For detailed information on power dissipation, see the Power
Dissipation and Thermal Considerations section.
VOUT2, VOUT3, VOUT4, FB1, FB2,
FB3, FB4, EN1, EN2, EN3, EN4,
MODE to Ground
Range
Rating
−0.3 V to +6 V
−0.3 V to (VIN1 + 0.3 V)
−0.3 V to +0.3 V
−65°C to +150°C
−40°C to +125°C
JEDEC J-STD-020
±1500 V
±500 V
±100 V
Rev. 0 | Page 6 of 28
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 6. Thermal Resistance
Package Type
24-Lead, 0.5 mm pitch LFCSP
ESD CAUTION
JA
is specified for the worst-case conditions, that is, a device
θ
35
JA
θ
3
JC
Unit
°C/W