MT57V256H36E Micron Semiconductor Products, Inc., MT57V256H36E Datasheet - Page 20

• Manufacturer Part Number: MT57V256H36E
• Description: 9Mb DDR SRAM 2.5V Vdd, HSTL Pipelined
• Manufacturer: Micron Semiconductor Products, Inc.

NOTE:
DATA SHEET DESIGNATION
256K x 36 2.5V V
MT57V256H36E_16_B.fm - Rev. B, Pub. 1/03
E-mail: [e-mail], Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
All dimensions are in millimeters.
SOLDER BALL DIAMETER REFERS
TO POST REFLOW CONDITION. THE
PRE-REFLOW DIAMETER IS Ø 0.40
Advance: This data sheet contains initial descriptions of products still under development.
DD
, HSTL, Pipelined DDR SRAM
Micron and the M logo are registered trademarks and the Micron logo is a trademark of Micron Technology, Inc.
15.00 ±0.10
165X Ø 0.45
BALL A11
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
7.50 ±0.05
7.00 ±0.05
0.85 ±0.075
5.00 ±0.05
13.00 ±0.10
10.00
6.50 ±0.05
1.00
TYP
165-Ball FBGA
0.16µm Process
Figure 11:
2.5V V
C
1.00
TYP
20
BALL A1
PIN A1 ID
14.00
SEATING PLANE
0.12 C
®
DD
, HSTL, PIPELINED DDR SRAM
1.20 MAX
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb
SOLDER BALL PAD: Ø .33mm
PIN A1 ID
256K x 36
©2003, Micron Technology Inc.
ADVANCE