MT28F160C34 Micron Technology, MT28F160C34 Datasheet - Page 27
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MT28F160C34
Manufacturer Part Number
MT28F160C34
Description
FLASH MEMORY
Manufacturer
Micron Technology
Datasheet
1.MT28F160C34.pdf
(28 pages)
DataSheet4U.com
www.DataSheet4U.com
DataSheet
NOTE: 1. All dimensions in millimeters MAX or typical where noted.
DATA SHEET DESIGNATION
Advance
1 Meg x 16 3V Enhanced+ Boot Block Flash Memory
MT28F160C34_3.p65 – Rev. 3, Pub. 8/01
4
7.00 ±.10
U
.10
.com
Ø
E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.25mm per side.
.35 +.05
A
Micron is a registered trademark and the Micron logo and M logo are trademarks of Micron Technology, Inc.
1.875 ±.05
3.50 ±.05
-.10
This data sheet contains initial descriptions of products still under development.
(TYP)
.80 ±.075
A
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
2.625 ±.05
8.00 ±.10
5.25
4.00 ±.05
MIN
3V ENHANCED+ BOOT BLOCK FLASH MEMORY
(TYP)
.75
.75 (TYP)
46-BALL FBGA
DataSheet4U.com
PIN #1 ID
3.75
27
Micron Technology, Inc., reserves the right to change products or specifications without notice.
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb
SOLDER BALL PAD: Ø .27mm
SUBSTRATE: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
1.20 MAX
PIN #1 ID
1 MEG x 16
©2001, Micron Technology, Inc.
ADVANCE