D75208CW NEC, D75208CW Datasheet - Page 57
D75208CW
Manufacturer Part Number
D75208CW
Description
Search -----> UPD75208
Manufacturer
NEC
Datasheet
1.D75208CW.pdf
(62 pages)
- Current page: 57 of 62
- Download datasheet (471Kb)
www.DataSheet4U.com
15. RECOMMENDED SOLDERING CONDITIONS
“Semiconductor Device Mount Technology” (IEI-1207).
* For the storage period after dry-pack decompression storage conditions are max. 25 C, 65 % RH.
Note Use of more than one soldering method should be avoided (except in the case of pin part heating).
Note
Soldering Method
Soldering Method
This product should be soldered and mounted under the conditions recommended below.
For details of recommended soldering conditions for the surface mounting type, refer to the document
For soldering methods and conditions other than those recommended below, contact our salesman.
Wave soldering
Infrared reflow
VPS
Pin part heating
Pin part heating
Wave soldering
(lead part only)
PD75208GF-
PD75208CW-
Ensure that the application of wave soldering is limited to the lead part and no solder touches the main
unit directly.
-3BE : 64-pin plastic QFP (body 14
Solder bath temperature: 260 C or less, Duration: 10 sec. max.
Number of times: Once, Time limit: 7 days* (thereafter 10 hours prebaking required
at 125 C)
Preheating temperature : 120 C max. (package surface temperature)
Package peak temperature: 230 C, Duration: 30 sec. max. (at 210 C or above),
Number of times: Once, Time limit: 7 days*(thereafter 10 hours prebaking required
at 125 C)
Package peak temperature: 215 C, Duration: 40 sec. max. (at 200 C or above),
Number of times: Once, Time limit: 7 days* (thereafter 10 hours prebaking required
at 125 C)
Pin part temperature: 300 C or below , Duration: 3 sec. max. (per device side)
Solder bath temperature: 260 C or below , Duration: 10 sec. max.
Pin part temperature: 260 C or below , Duration: 10 sec. max.
: 64-pin plastic shrink DIP (750 mil)
Table 15-1 Surface Mounting Type Conditions
Table 15-2 Insertion Type Soldering Conditions
Soldiering Conditions
Soldering Conditions
20 mm)
Condition Symbol
Recommended
WS60-107-1
IR30-107-1
VP15-107-1
PD75208
–––
57
Related parts for D75208CW
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
16/8 bit single-chip microcomputer
Manufacturer:
NEC
Datasheet:
Part Number:
Description:
Dual audio power amp circuit
Manufacturer:
NEC
Datasheet:
Part Number:
Description:
Dual comparator
Manufacturer:
NEC
Datasheet:
Part Number:
Description:
MOS type composite field effect transistor
Manufacturer:
NEC
Datasheet:
Part Number:
Description:
50 V/100 mA FET array incorporating 2 N-ch MOSFETs
Manufacturer:
NEC
Datasheet:
Part Number:
Description:
6-pin small MM high-frequency double transistor
Manufacturer:
NEC
Datasheet:
Part Number:
Description:
6-pin small MM high-frequency double transistor
Manufacturer:
NEC
Datasheet:
Part Number:
Description:
6-pin small MM high-frequency double transistor
Manufacturer:
NEC
Datasheet:
Part Number:
Description:
6-pin small MM high-frequency double transistor
Manufacturer:
NEC
Datasheet:
Part Number:
Description:
Twin transistors equipped with different model chips(6P small MM)
Manufacturer:
NEC
Datasheet:
Part Number:
Description:
Bipolar analog integrated circuit
Manufacturer:
NEC
Datasheet: