BAS70-1PS7XSB70-SER NXP Semiconductors, BAS70-1PS7XSB70-SER Datasheet
BAS70-1PS7XSB70-SER
Related parts for BAS70-1PS7XSB70-SER
BAS70-1PS7XSB70-SER Summary of contents
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... BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes Rev. 08 — 4 May 2006 1. Product profile 1.1 General description General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages. Table 1. Type number 1PS76SB70 1PS79SB70 BAS70 BAS70H BAS70L BAS70W BAS70-04 BAS70-04W BAS70-05 BAS70-05W BAS70-06 BAS70-06W BAS70-07 ...
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... Pin BAS70H; 1PS76SB70; 1PS79SB70 1 2 BAS70L 1 2 BAS70; BAS70W BAS70-04; BAS70-04W BAS70_1PS7XSB70_SER_8 Product data sheet BAS70 series; 1PS7xSB70 series Quick reference data Parameter Conditions forward current forward voltage I F reverse voltage 300 s; 0.02. p Pinning Description cathode anode cathode anode ...
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... BAS70VV BAS70_1PS7XSB70_SER_8 Product data sheet BAS70 series; 1PS7xSB70 series Pinning …continued Description anode (diode 1) anode (diode 2) cathode (diode 1), cathode (diode 2) cathode (diode 1) cathode (diode 2) anode (diode 1), anode (diode 2) cathode (diode 1) cathode (diode 2) anode (diode 2) anode (diode 1) ...
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... BAS70-04 BAS70-04W BAS70-05 BAS70-05W BAS70-06 BAS70-06W BAS70-07 BAS70-07S BAS70-07V BAS70VV BAS70XY BAS70_1PS7XSB70_SER_8 Product data sheet BAS70 series; 1PS7xSB70 series Pinning …continued Description anode (diode 1) cathode (diode 2) anode (diode 3), cathode (diode 4) anode (diode 4) cathode (diode 3) cathode (diode 1), anode (diode 2) Ordering information Package ...
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... Per diode FRM I FSM amb T stg [ prior to surge. j BAS70_1PS7XSB70_SER_8 Product data sheet BAS70 series; 1PS7xSB70 series Marking codes [1] Marking code 73* 74* 74* 75* Limiting values Parameter Conditions reverse voltage forward current repetitive peak forward t current ...
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... C unless otherwise specified. amb Symbol Per diode [1] Pulse test: t BAS70_1PS7XSB70_SER_8 Product data sheet BAS70 series; 1PS7xSB70 series Thermal characteristics Parameter Conditions thermal resistance from in free air junction to ambient SOT23 SOT143B SOT363 (BAS70-07S) SOT666 (BAS70VV) SOT666 (BAS70-07V) SOD123F SOD323 ...
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... Fig 3. Differential forward resistance as a function of forward current; typical values BAS70_1PS7XSB70_SER_8 Product data sheet BAS70 series; 1PS7xSB70 series mra803 0.6 0 (V) F (1) T (2) T (3) T Fig 2. Reverse current as a function of reverse mra802 (mA) F Fig 4 ...
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... Fig 5. Package outline SOD323 (SC-76) 3.0 2.8 3 2.5 1.4 2.1 1.2 1 1.9 Dimensions in mm Fig 7. Package outline SOT23 (TO-236AB) 0.62 0.55 2 0.30 0.22 0.65 0.30 0.22 1 0.55 cathode marking on top side 0.47 Dimensions in mm Fig 9. Package outline SOD882 BAS70_1PS7XSB70_SER_8 Product data sheet BAS70 series; 1PS7xSB70 series 1.1 0.8 0.45 0.15 1.65 1.55 0.25 0.10 03-12-17 Dimensions in mm Fig 6. Package outline SOD523 (SC-79) 1.1 0.9 0.45 0.15 2 0.48 0.15 0.38 0.09 04-11-04 Dimensions in mm Fig 8. Package outline SOD123F 0.50 0.46 2.2 1.02 2 ...
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... Philips Semiconductors 3.0 2.8 1.9 4 2.5 1.4 2.1 1.2 1 0.88 0.78 1.7 Dimensions in mm Fig 11. Package outline SOT143B Fig 13. Package outline SOT666 BAS70_1PS7XSB70_SER_8 Product data sheet BAS70 series; 1PS7xSB70 series 1.1 0.9 3 0.45 0.15 2.2 2.0 2 0.48 0.15 0.38 0.09 Dimensions in mm 04-11-16 Fig 12. Package outline SOT363 (SC-88) 1.7 1 1.7 1.3 1.5 1.1 pin 1 index 0.27 0.5 0.17 1 Dimensions in mm Rev. 08 — 4 May 2006 General-purpose Schottky diodes 2 ...
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... For further information and the availability of packing methods, see [2] T1: normal taping [3] T2: reverse taping BAS70_1PS7XSB70_SER_8 Product data sheet BAS70 series; 1PS7xSB70 series Packing methods Description SOD323 4 mm pitch tape and reel SOD523 2 mm pitch tape and reel 4 mm pitch tape and reel ...
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... Philips Semiconductors 10. Soldering Fig 14. Reflow soldering footprint SOD323 (SC-76) Fig 15. Wave soldering footprint SOD323 (SC-76) Fig 16. Reflow soldering footprint SOD523 (SC-79) BAS70_1PS7XSB70_SER_8 Product data sheet BAS70 series; 1PS7xSB70 series 3.05 2.80 2.10 1.60 1.65 0.95 0. Dimensions in mm 5.00 4.40 1.40 2.75 1.20 preferred transport direction during soldering Dimensions in mm 1.20 solder paste solder lands ...
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... Philips Semiconductors Fig 17. Reflow soldering footprint SOT23 (TO-236AB) 4.60 4.00 Fig 18. Wave soldering footprint SOT23 (TO-236AB) BAS70_1PS7XSB70_SER_8 Product data sheet BAS70 series; 1PS7xSB70 series 2.90 2.50 2 0.85 1.30 3.00 0.85 3 1.00 3.30 Dimensions in mm 3.40 1.20 (2x) 2 1.20 3 2.80 4.50 Dimensions in mm Rev. 08 — 4 May 2006 General-purpose Schottky diodes solder lands solder resist 1 occupied area 2 ...
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... Philips Semiconductors Fig 19. Reflow soldering footprint SOD123F 0.90 Fig 20. Reflow soldering footprint SOD882 BAS70_1PS7XSB70_SER_8 Product data sheet BAS70 series; 1PS7xSB70 series 4.4 4 2.9 1.6 2.1 1.6 1 Reflow soldering is the only recommended soldering method. Dimensions in mm 1.30 0. Reflow soldering is the only recommended soldering method. ...
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... Philips Semiconductors Fig 21. Reflow soldering footprint SOT323 (SC-70) Fig 22. Wave soldering footprint SOT323 (SC-70) BAS70_1PS7XSB70_SER_8 Product data sheet BAS70 series; 1PS7xSB70 series 2.65 0.75 1.30 3 0.60 2.35 0.85 (3x) 0.55 (3x) 2.40 Dimensions in mm 4.60 4.00 1. 3.65 2.10 1 preferred transport direction during soldering Dimensions in mm Rev. 08 — 4 May 2006 General-purpose Schottky diodes 1.325 solder lands ...
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... Philips Semiconductors Fig 23. Reflow soldering footprint SOT143B Fig 24. Wave soldering footprint SOT143B BAS70_1PS7XSB70_SER_8 Product data sheet BAS70 series; 1PS7xSB70 series 3.25 0.60 (3x) 0.50 (3x) 0.60 (4x) 4 2.70 1 0.90 1.00 2.50 Dimensions in mm 4.45 1.20 (3x 1. 1.00 3.40 Dimensions in mm Rev. 08 — 4 May 2006 General-purpose Schottky diodes solder lands solder resist 3 occupied area 1 ...
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... Philips Semiconductors Fig 25. Reflow soldering footprint SOT363 (SC-88) Dimensions in mm Fig 26. Wave soldering footprint SOT363 (SC-88) BAS70_1PS7XSB70_SER_8 Product data sheet BAS70 series; 1PS7xSB70 series 2.35 0.50 solder paste (4 ) solder lands solder resist occupied area Dimensions in mm 4.50 solder lands solder resist occupied area transport direction during soldering Rev. 08 — ...
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... Philips Semiconductors Fig 27. Reflow soldering footprint SOT666 BAS70_1PS7XSB70_SER_8 Product data sheet BAS70 series; 1PS7xSB70 series 0.55 2.00 1.70 1. solder lands 0.075 solder resist Reflow soldering is the only recommended soldering method. Rev. 08 — 4 May 2006 General-purpose Schottky diodes 2.75 2.45 2.10 1. 0.375 (4 ) 1.20 2.20 2.50 placement area occupied area Dimensions in mm © ...
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... Philips Semiconductors 11. Revision history Table 10. Revision history Document ID Release date BAS70_1PS7XSB70_ 20060504 SER_8 • Modifications: Type number BAS70XY added • Table 9 “Packing • Figure 26 “Wave soldering footprint SOT363 • Figure 27 “Reflow soldering footprint • Section 12 “Legal BAS70_1PS7XSB70_ 20050718 SER_7 ...
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... For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com BAS70_1PS7XSB70_SER_8 Product data sheet BAS70 series; 1PS7xSB70 series [3] Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. ...
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... Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 13 Contact information Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 BAS70 series; 1PS7xSB70 series Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © Koninklijke Philips Electronics N.V. 2006. For more information, please visit: http://www.semiconductors.philips.com. ...