BAS70-1PS7XSB70-SER NXP Semiconductors, BAS70-1PS7XSB70-SER Datasheet - Page 11
BAS70-1PS7XSB70-SER
Manufacturer Part Number
BAS70-1PS7XSB70-SER
Description
Bas70 Series; 1ps7xsb70 Series General-purpose Schottky Diodes
Manufacturer
NXP Semiconductors
Datasheet
1.BAS70-1PS7XSB70-SER.pdf
(20 pages)
Philips Semiconductors
10. Soldering
BAS70_1PS7XSB70_SER_8
Product data sheet
Fig 14. Reflow soldering footprint SOD323 (SC-76)
Fig 15. Wave soldering footprint SOD323 (SC-76)
Fig 16. Reflow soldering footprint SOD523 (SC-79)
Dimensions in mm
Dimensions in mm
Reflow soldering is the only recommended soldering method.
Dimensions in mm
2.75
1.65
1.20
0.95
BAS70 series; 1PS7xSB70 series
preferred transport direction during soldering
0.50
(2 )
solder lands
solder resist
solder paste
occupied area
Rev. 08 — 4 May 2006
3.05
2.80
2.10
1.60
5.00
4.40
1.40
1.20
0.50
msa433
1.80
1.90
0.60
2.15
General-purpose Schottky diodes
0.30
0.40
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
MGS343
0.50
0.60
solder lands
solder resist
occupied area
solder paste
solder lands
solder resist
occupied area
MSA415
11 of 20