BAS70-1PS7XSB70-SER NXP Semiconductors, BAS70-1PS7XSB70-SER Datasheet - Page 6

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BAS70-1PS7XSB70-SER

Manufacturer Part Number
BAS70-1PS7XSB70-SER
Description
Bas70 Series; 1ps7xsb70 Series General-purpose Schottky Diodes
Manufacturer
NXP Semiconductors
Datasheet
Philips Semiconductors
6. Thermal characteristics
7. Characteristics
BAS70_1PS7XSB70_SER_8
Product data sheet
Table 7.
[1]
[2]
[3]
Table 8.
T
[1]
Symbol
Per device
R
R
Symbol
Per diode
V
I
C
R
amb
F
th(j-a)
th(j-sp)
d
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Reflow soldering is the only recommended soldering method.
Soldering point at pins 2, 3, 5 and 6.
Pulse test: t
= 25 C unless otherwise specified.
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to solder point
Parameter
forward voltage
reverse current
diode capacitance
Thermal characteristics
Characteristics
SOT23
SOT143B
SOT363 (BAS70-07S)
SOT666 (BAS70VV)
SOT666 (BAS70-07V)
SOD123F
SOD323
SOD523
SOD882
SOT323
SOT363 (BAS70XY)
p
300 s;
BAS70 series; 1PS7xSB70 series
Rev. 08 — 4 May 2006
0.02.
Conditions
I
I
I
V
V
V
F
F
F
R
R
R
= 1 mA
= 10 mA
= 15 mA
= 50 V
= 70 V
= 0 V; f = 1 MHz
Conditions
in free air
General-purpose Schottky diodes
[1]
[1]
[2]
[2]
[2]
[2]
[2]
[3]
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Min
-
-
-
-
-
-
Min
-
-
-
-
-
-
-
-
-
-
-
Typ
-
-
-
-
-
-
Typ
-
-
-
-
-
-
-
-
-
-
-
Max
500
500
416
700
416
330
450
450
500
625
260
Max
410
750
1
100
10
2
Unit
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
Unit
mV
mV
V
nA
pF
A
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