D6376 NEC, D6376 Datasheet - Page 16
D6376
Manufacturer Part Number
D6376
Description
Search -----> UPD6376
Manufacturer
NEC
Datasheet
1.D6376.pdf
(20 pages)
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8. RECOMMENDED SOLDERING CONDITIONS
Manual (C10535E).
representative.
Surface Mount Type Soldering Conditions
16
Soldering Process
PD6376GS: 16-pin Plastic SOP (300 mil)
Infrared reflow
VPS
Pin Partial heating
The following conditions must be met when performing soldering for the PD6376.
For more detailed information, refer to the information document Semiconductor Device Mounting Technology
For soldering methods and conditions other than the recommended conditions, please consult with an NEC sales
Caution Do not use different soldering methods together (except for pin partial heating).
Peak package temperature: 230 C, Time: 30 seconds max. (at 210 C or higher),
Count: Once
Peak package temperature: 215 C, Time: 40 seconds max. (at 200 C or higher),
Count: Once
Pin temperature: 300 C or less, Time: 3 seconds max. (per pin row)
Soldering Conditions
IR30-00-1
VP-15-00-1
Symbol
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PD6376
Datasheet pdf - http://www.DataSheet4U.net/