mt48h16m16lfbf-75 Micron Semiconductor Products, mt48h16m16lfbf-75 Datasheet - Page 73

• Manufacturer Part Number: mt48h16m16lfbf-75
• Description: 256mb X16, X32 Mobile Sdram
• Manufacturer: Micron Semiconductor Products

Package Dimensions
Figure 53: 54-Ball VFBGA (8mm x 9mm)
PDF:09005aef8219eeeb/Source: 09005aef8219eedd
256mb_x16_sdram_y36m_1.fm - Rev G 2/08 EN
CONDITION. THE PRE-
REFLOW DIAMETER
DIAMETER REFERS
TO POST REFLOW
IS 0.42 ON A 0.40
SMD BALL PAD.
6.40
SOLDER BALL
54X Ø0.45
SEATING
PLANE
BALL A9
0.10 A
3.20
Notes:
A
1. All dimensions are in millimeters.
3.20
8.00 ±0.10
6.40
C L
0.80
TYP
4.00 ±0.05
C L
4.50 ±0.05
0.80 TYP
0.65 ±0.05
BALL A1
BALL A1 ID
73
9.00 ± 0.10
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
256Mb: x16, x32 Mobile SDRAM
MOLD COMPOUND: EPOXY NOVOLAC
SOLDER BALL MATERIAL:
SUBSTRATE MATERIAL: PLASTIC LAMINATE
SAC105 (98.5% Sn, 1% Ag, 0.5% Cu)
Package Dimensions
©2006 Micron Technology, Inc. All rights reserved
MICRON LOGO
TO BE LASED
BALL A1 ID