pcf8576d NXP Semiconductors, pcf8576d Datasheet - Page 31

• Manufacturer Part Number: pcf8576d
• Description: Universal Lcd Driver For Low Multiplex Rates
• Manufacturer: NXP Semiconductors

Philips Semiconductors
12 BONDING PAD INFORMATION
Table 15 Bonding pad locations
All x/y coordinates represent the position of the centre of
each pad (in m) with respect to the centre (x/y = 0) of the
chip (see Fig.23).
2004 Dec 22
SDA
SCL
SCL
SYNC
CLK
V
OSC
A0
A1
A2
SA0
V
V
BP0
BP2
BP1
BP3
S0
S1
S2
S3
S4
S5
S6
S7
S8
S9
S10
S11
S12
S13
S14
S15
S16
S17
SYMBOL
DD
SS
LCD
Universal LCD driver for low
multiplex rates
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
PAD
+109.53
+181.53
+365.58
+469.08
+577.08
+740.88
+835.83
+1005.48
+1005.48
+1005.48
+1005.48
1005.48
1005.48
1005.48
1005.48
1005.48
1005.48
1005.48
1005.48
1005.48
347.22
263.97
180.72
97.47
14.22
34.38
69.03
152.28
235.53
318.78
402.03
485.28
568.53
651.78
735.03
COORDINATES
x
10.71
156.51
232.74
308.97
385.2
493.2
565.2
637.2
709.2
876.6
876.6
876.6
876.6
876.6
+876.6
+876.6
+876.6
+876.6
+876.6
+876.6
+876.6
+876.6
+876.6
876.6
876.6
876.6
876.6
876.6
876.6
876.6
876.6
630.9
513.9
396.9
221.4
y
31
Table 16 Gold bump dimension PCF8576DU/2DA/2
S18
S19
S20
S21
S22
S23
S24
S25
S26
S27
S28
S29
S30
S31
S32
S33
S34
S35
S36
S37
S38
S39
SDA
SDA
Alignment marks
C1
C2
Gold bump dimension
Gold bump tolerance
SYMBOL
DESCRIPTION
57
58
59
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
PAD
+930.42
52 m
3 m
1005.5
1005.5
1005.5
1005.5
1005.5
1005.5
1005.5
1005.5
1005.5
1005.5
1005.5
1005.5
1005.5
1005.5
1005.5
1005.5
735.03
663.03
591.03
519.03
447.03
375.03
196.38
106.38
829.98
COORDINATES
x
Product specification
DIMENSION
PCF8576D
80 m
+625.59
+541.62
+458.19
+374.76
+291.33
+207.9
+124.47
+41.04
42.39
125.8
209.3
292.7
376.1
459.5
543
625.6
876.6
876.6
876.6
876.6
876.6
876.6
876.6
876.6
870.3
870.3
15 m
y