pcf8813 NXP Semiconductors, pcf8813 Datasheet - Page 68

• Manufacturer Part Number: pcf8813
• Description: 67 + 1 X 102 Pixels Matrix Lcd Driver
• Manufacturer: NXP Semiconductors

Philips Semiconductors
Table 28 Bump size
2004 Mar 05
handbook, halfpage
Bump width
Bump length
Bump height
Minimum pad pitch
Pad size, aluminium
Maximum wafer thickness, including bumps
Typical wafer thickness, without bumps
(67 + 1)
1.845
mm
y
PARAMETER
Fig.56 Chip dimensions.
102 pixels matrix LCD driver
x
10.845 mm
pitch
MGU650
45
VALUE
( m)
17.5
430
381
32
81
54
81
68
handbook, halfpage
d = 90 m; there are two 90 m alignment marks.
y
Fig.57 Shape of alignment mark.
center
x
center
MGU651
Product specification
d
PCF8813