tda8000t NXP Semiconductors, tda8000t Datasheet - Page 11

• Manufacturer Part Number: tda8000t
• Description: Smart Card Interface
• Manufacturer: NXP Semiconductors

Philips Semiconductors
HANDLING
Each pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining.
Method 3015 (HBM 1500 , 100 pF) 3 pulses positive and 3 pulses negative; on each pin referenced to ground.
THERMAL CHARACTERISTICS
1996 Dec 12
handbook, halfpage
R
SYMBOL
Smart card interface
th j-a
P tot
(W)
4
3
2
1
0
50
Fig.10 Power derating curve (DIP28).
thermal resistance from junction to ambient in free air
SOT117-1
SOT136-1
0
50
100
T
amb
PARAMETER
MBE256
( C)
o
150
11
handbook, halfpage
P tot
(W)
3
2
1
0
50
Fig.11 Power derating curve (SO28).
0
TDA8000; TDA8000T
50
VALUE
30
70
Product specification
100
T
amb
MBE255
( C)
o
UNIT
150
K/W
K/W