tda8000t NXP Semiconductors, tda8000t Datasheet - Page 20

• Manufacturer Part Number: tda8000t
• Description: Smart Card Interface
• Manufacturer: NXP Semiconductors

Philips Semiconductors
PACKAGE OUTLINES
DIP28: plastic dual in-line package; 28 leads (600 mil)
1996 Dec 12
handbook, full pagewidth
Smart card interface
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
Note
inches
UNIT
mm
SOT117-1
OUTLINE
VERSION
L
Z
max.
0.20
28
5.1
1
A
pin 1 index
0.020
min.
0.51
A
1
051G05
IEC
max.
0.16
4.0
A
2
0.066
0.051
1.7
1.3
b
e
MO-015AH
D
0.020
0.014
0.53
0.38
JEDEC
b
1
REFERENCES
0.013
0.009
0.32
0.23
c
0
b
36.0
35.0
1.41
1.34
D
(1)
scale
EIAJ
20
5
14.1
13.7
0.56
0.54
E
(1)
15
14
b
1
10 mm
2.54
0.10
e
A
1
w
E
M
A
15.24
2
0.60
e
1
A
0.15
0.13
3.9
3.4
TDA8000; TDA8000T
L
PROJECTION
EUROPEAN
c
15.80
15.24
0.62
0.60
M
E
17.15
15.90
0.68
0.63
M
(e )
M
Product specification
M
H
H
1
E
ISSUE DATE
0.01
0.25
92-11-17
95-01-14
w
SOT117-1
max.
0.067
Z
1.7
(1)