tda8023 NXP Semiconductors, tda8023 Datasheet - Page 28
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tda8023
Manufacturer Part Number
tda8023
Description
Tda8023 Low Power Ic Card Interface
Manufacturer
NXP Semiconductors
Datasheet
1.TDA8023.pdf
(32 pages)
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NXP Semiconductors
TDA8023_1
Product data sheet
14.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 22.
Table 23.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 22
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
23
11.
Rev. 01 — 16 July 2007
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
11) than a PbSn process, thus
220
220
Low power IC card interface
350
> 2000
260
245
245
TDA8023
© NXP B.V. 2007. All rights reserved.
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