mpc8309 Freescale Semiconductor, Inc, mpc8309 Datasheet - Page 53

• Manufacturer Part Number: mpc8309
• Description: Powerquicc Ii Pro Integrated Communications Processor Family Hardware Specifications
• Manufacturer: Freescale Semiconductor, Inc

22 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8309 is available in
a thermally enhanced MAPBGA (mold array process-ball grid array); see
Parameters for the MPC8309,”
for information on the MAPBGA.
22.1
The package parameters are as provided in the following list.
22.2
Freescale Semiconductor
MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 0
Package outline
Package Type
Interconnects
Pitch
Module height (typical)
Solder Balls
Ball diameter (typical)
Figure 44
489-MAPBGA package.
Package Parameters for the MPC8309
Mechanical Dimensions of the MPC8309 MAPBGA
shows the mechanical dimensions and bottom surface nomenclature of the MPC8309,
and
Section 22.2, “Mechanical Dimensions of the MPC8309 MAPBGA,”
19 mm 19 mm
MAPBGA
489
0.80 mm
96 Sn / 3.5 Ag / 0.5 Cu (VM package)
0.40 mm
1.48 mm; Min = 1.31mm and Max 1.61mm
Section 22.1, “Package
Package and Pin Listings
53