mfrc52301hn1-trayb NXP Semiconductors, mfrc52301hn1-trayb Datasheet - Page 87

• Manufacturer Part Number: mfrc52301hn1-trayb
• Description: Contactless Reader Ic
• Manufacturer: NXP Semiconductors

NXP Semiconductors
18. Handling information
19. Packing information
MFRC523_33
Product data sheet
PUBLIC
Fig 34. Packing information 1 tray
chamfer
PIN 1
chamfer
PIN 1
printed piano box
The straps around the package of
stacked trays inside the piano-box
have sufficient pre-tension to avoid
loosening of the trays.
Detailed package information can be found at:
http://www.nxp.com/package/SOT617-1.html.
Moisture Sensitivity Level (MSL) evaluation has been performed according to
SNW-FQ-225B rev.04/07/07 (JEDEC J-STD-020C). MSL for this package is level 1 which
means 260 °C convection reflow temperature.
Dry pack is not required.
Unlimited out-of-pack floor life at maximum ambient 30 °C/85 % RH.
All information provided in this document is subject to legal disclaimers.
Rev. 3.3 — 5 March 2010
115233
strap 46 mm from corner
tray
In the traystack (2 trays)
only ONE tray type* allowed
*one supplier and one revision number.
barcode label (permanent)
ESD warning preprinted
barcode label (peel-off)
Hyatt patent preprinted
Contactless reader IC
MFRC523
001aaj740
QA seal
© NXP B.V. 2010. All rights reserved.
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