tda18219hn NXP Semiconductors, tda18219hn Datasheet - Page 42

• Manufacturer Part Number: tda18219hn
• Description: Silicon Tuner For Terrestrial And Cable Digital Tv Reception
• Manufacturer: NXP Semiconductors

NXP Semiconductors
TDA18219HN_1
Objective data sheet
18.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 38.
Table 39.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
≥ 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 38
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
39
18.
Rev. 01 — 3 February 2010
Package reflow temperature (°C)
Volume (mm
< 350
235
220
Package reflow temperature (°C)
Volume (mm
< 350
260
260
250
Silicon Tuner for terrestrial and cable digital TV reception
3
3
)
)
Figure
350 to 2 000
260
250
245
18) than a SnPb process, thus
≥ 350
220
220
TDA18219HN
> 2 000
260
245
245
© NXP B.V. 2010. All rights reserved.
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