uaa2077am NXP Semiconductors, uaa2077am Datasheet - Page 12

• Manufacturer Part Number: uaa2077am
• Description: Image Rejecting Front-end For Dect Applications
• Manufacturer: NXP Semiconductors

Philips Semiconductors
PACKAGE OUTLINE
1996 Jul 04
SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm
Image rejecting front-end
for DECT applications
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT266-1
max.
1.5
A
0.15
A
0
20
1
1
Z
y
A
1.4
1.2
2
pin 1 index
IEC
0.25
A
3
e
D
0.32
0.20
b
p
0.20
0.13
JEDEC
c
b
p
REFERENCES
D
6.6
6.4
0
(1)
11
10
w
E
4.5
4.3
M
(1)
scale
EIAJ
2.5
0.65
12
e
c
H
6.6
6.2
E
A
2
A
5 mm
1.0
L
1
0.75
0.45
L
p
H
E
E
detail X
0.65
0.45
Q
L
L
PROJECTION
p
EUROPEAN
Q
0.2
v
(A )
3
A
0.13
w
UAA2077AM
Product specification
A
X
v
0.1
y
M
ISSUE DATE
A
90-04-05
95-02-25
0.48
0.18
Z
(1)
SOT266-1
10
0
o
o