uaa2077am NXP Semiconductors, uaa2077am Datasheet - Page 6

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uaa2077am

Manufacturer Part Number
uaa2077am
Description
Image Rejecting Front-end For Dect Applications
Manufacturer
NXP Semiconductors
Datasheet
Philips Semiconductors
Table 1 Control of power status
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
THERMAL CHARACTERISTICS
HANDLING
Every pin withstands the ESD test in accordance with “MIL-STD-883C Class 2 (method 3015.5)” .
DC CHARACTERISTICS
V
1996 Jul 04
V
P
T
P
T
R
Pins V
V
I
I
I
Pins RXON, SXON and SBS
V
V
V
I
I
SYMBOL
SYMBOL
CC
CC(RX)
CC(PD)
CC(SX)
IH
IL
SYMBOL
GND
j(max)
stg
CC
l(max)
max
CC
th
IH
IL
Image rejecting front-end
for DECT applications
th j-a
= 4.0 V; T
CCLNA
RXON
HIGH
LOW
LOW
supply voltage
difference in ground supply voltage applied between LOGND and LNAGND
maximum power input
maximum operating junction temperature
maximum power dissipation
IC storage temperature
thermal resistance from junction to ambient in free air
supply voltage
supply current in RX mode
supply current in power-down mode
supply current in SX mode
CMOS threshold voltage
HIGH level input voltage
LOW level input voltage
HIGH level static input current
LOW level static input current
and V
amb
EXTERNAL PIN LEVEL
= 25 C; unless otherwise specified.
CCLO
PARAMETER
SXON
HIGH
LOW
X
PARAMETER
PARAMETER
T
over full temperature range 3.6
note 1
pin at V
pin at 0.4 V
amb
= 0 to +70 C
CONDITIONS
6
power-down mode
RX mode (receive and LO sections on)
SX mode (only LO section on)
CC
0.4 V
CIRCUIT MODE OF OPERATION
3.15
21.5
3
0.7V
0.3
1
1
MIN.
CC
65
4.0
4.0
26.5
0.2
5
1.25
MIN.
VALUE
TYP.
120
UAA2077AM
Product specification
9
0.6
20
150
250
+150
5.3
5.3
33.5
50
7
V
+0.8
+1
+1
MAX.
MAX.
CC
UNIT
K/W
V
V
dBm
mW
V
V
mA
mA
V
V
V
C
C
UNIT
A
A
A
UNIT

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