lpc2210fbd144-01 NXP Semiconductors, lpc2210fbd144-01 Datasheet - Page 2

• Manufacturer Part Number: lpc2210fbd144-01
• Description: 16/32-bit Arm Microcontroller With 10-bit Adc And External Memory Interface
• Manufacturer: NXP Semiconductors

NXP Semiconductors
3. Ordering information
LPC2210_2220_5
Product data sheet
I
I
I
I
I
I
I
I
I
Table 1.
Type number
LPC2210FBD144
LPC2210FBD144/01 LQFP144
LPC2220FBD144
LPC2220FET144
LPC2220FET144/G
Vectored Interrupt Controller (VIC) with configurable priorities and vector addresses.
Configurable external memory interface with up to four banks, each up to 16 MB and
8/16/32-bit data width.
Up to 76 general purpose pins (5 V tolerant) capable. Up to nine edge/level sensitive
external interrupt pins available.
60 MHz (LPC2210) and 75 MHz (LPC2210/01 and LPC2220) maximum CPU clock
available from programmable on-chip Phase-Locked Loop (PLL) with settling time of
100 s.
On-chip integrated oscillator operates with external crystal in range of 1 MHz to
30 MHz and with external oscillator up to 50 MHz.
Power saving modes include Idle and Power-down.
Processor wake-up from Power-down mode via external interrupt.
Individual enable/disable of peripheral functions for power optimization.
Dual power supply:
N
N
N
N
LPC2210/01 and LPC2220 only: UART0/1 include fractional baud rate generator,
auto-bauding capabilities, and handshake flow-control fully implemented in
hardware.
LPC2210/01 and LPC2220 only: Fast GPIO ports enable port pin toggling up to 3.5
times faster than the original device. They also allow for a port pin to be read at any
time regardless of its function.
CPU operating voltage range of 1.65 V to 1.95 V (1.8 V
I/O power supply range of 3.0 V to 3.6 V (3.3 V
16/32-bit ARM7TDMI-S processor.
Ordering information
Package
Name
LQFP144
LQFP144
TFBGA144
TFBGA144
Rev. 5 — 20 December 2007
16/32-bit ARM microcontrollers with external memory interface
Description
plastic low profile quad flat package; 144
leads; body 20
plastic low profile quad flat package; 144
leads; body 20
plastic low profile quad flat package; 144
leads; body 20
plastic thin fine-pitch ball grid array package;
144 balls; body 12
plastic thin fine-pitch ball grid array package;
144 balls; body 12
20
20
20
12
12
1.4 mm
1.4 mm
1.4 mm
10 %) with 5 V tolerant I/O pads.
0.8 mm
0.8 mm
LPC2210/2220
0.15 V).
© NXP B.V. 2007. All rights reserved.
Version
SOT486-1
SOT486-1
SOT486-1
SOT569-1
SOT569-1
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