txc-03108 TranSwitch Corporation, txc-03108 Datasheet - Page 17

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txc-03108

Manufacturer Part Number
txc-03108
Description
8-channel Framer
Manufacturer
TranSwitch Corporation
Datasheet

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PACKAGE INFORMATION
The T1Fx8 device is available in two package formats. One is a 208-lead small outline plastic ball grid array package
suitable for surface mounting, as illustrated in Figure 4. The other is a 256-lead plastic ball grid array package
suitable for surface mounting, as illustrated in Figure 5.
(A3)
Notes:
D
1. All dimensions are in millimeters. Values shown are for
2. Identification of the solder ball A1 corner is contained
3. Size of array: 16 x 16, JEDEC code MO-151-AAF-1
D2
A2
reference only.
within this shaded zone. This package corner may be
a 90° angle, or chamfered for A1 identification.
Figure 4. T1FX8 TXC-03108 208-Lead Plastic Ball Grid Array Package Diagram
Proprietary TranSwitch Corporation Information for use Solely by its Customers
E1/4
TRANSWITCH
TXC-03108AIOG
Note 2
D1/4
E2
E
TECHNICAL OVERVIEW
- 17 of 24 -
A
A1
Dimension (Note 1)
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
D1 (BSC)
E1 (BSC)
A3 (Ref.)
e (BSC)
T R P N M L K J H G F E D C B
D2
A1
A2
E2
D
A
E
b
e
Bottom View
-E1-
15.00
15.00
1.35
0.30
0.75
0.40
Min
17.00
15.00
17.00
15.00
0.36
1.00
TXC-03108
b
Ed. 2, May 2001
TXC-03108-MA
15.70
15.70
A
Max
1.75
0.50
0.85
0.60
T1Fx8
-D1-

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