blf2022-70 NXP Semiconductors, blf2022-70 Datasheet

no-image

blf2022-70

Manufacturer Part Number
blf2022-70
Description
Uhf Power Ldmos Transistor
Manufacturer
NXP Semiconductors
Datasheet
Product specification
Supersedes data of 2002 Jul 04
book, halfpage
DATA SHEET
BLF2022-70
UHF power LDMOS transistor
M3D379
DISCRETE SEMICONDUCTORS
2003 Feb 24

Related parts for blf2022-70

blf2022-70 Summary of contents

Page 1

... DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D379 BLF2022-70 UHF power LDMOS transistor Product specification Supersedes data of 2002 Jul 04 2003 Feb 24 ...

Page 2

... For further information, refer to Philips specs.: SNW-EQ-608, SNW-FQ-302A and SNW-FQ-302B. 2003 Feb 24 PINNING - SOT502A handbook, halfpage (MHz) (V) = 2170 2170 CAUTION 2 Product specification BLF2022-70 PIN DESCRIPTION 1 drain 2 gate 3 source, connected to flange Top view MBK394 Fig.1 Simplified outline. P ...

Page 3

... APPLICATION INFORMATION RF performance in a common source class-AB circuit. T MODE OF OPERATION 2-tone, class- 2170 Ruggedness in class-AB operation The BLF2022-70 is capable of withstanding a load mismatch corresponding to VSWR = through all phases under the following conditions 2003 Feb 24 PARAMETER = 25 C; note 1 h CONDITIONS ...

Page 4

... P L (PEP) ( 2170 MHz 500 mA ( 600 mA. ( Fig.5 4 Product specification BLF2022- (PEP) ( 500 mA 2170.1 MHz. 2 Intermodulation distortion as a function of peak envelope load power; typical values. ...

Page 5

... MHz Two-carrier W-CDMA performance. Input signal: 3GPP W-CDMA 1-64DPCH with 66 % clipping; peak to average power ratio: 8 0.01 % and 9 0.0001 % (CCDF) per carrier; channel spacing/bandwidth = 5 MHz / 3.84 MHz. Measured in a W-CDMA application circuit. Fig.7 5 Product specification BLF2022- ACLR L(AV) (dBm ...

Page 6

... Fig gate C5 L4 L11 L10 Fig.10 Class-AB test circuit 2.2 GHz. 6 BLF2022- 1 500 mA Load impedance as a function of frequency (series components); typical values. ...

Page 7

... Product specification BLF2022-70 CATALOGUE NO. 2222 037 59109 2222 581 16641 2222 037 58101 4330 030 36301 2322 156 11009 = 2.2); thickness 0.79 mm. ...

Page 8

... The other side is unetched and serves as a ground plane. Fig.11 Component layout for 2.2 GHz class-AB test circuit. 2003 Feb 24 50 INPUT PH990109 C14 C5 C13 INPUT PH990109 8 Product specification BLF2022- OUTPUT PH990110 R2 C11 C12 F1 C10 OUTPUT PH990110 MGU538 = 2.2), thickness 0.79 mm. ...

Page 9

... REFERENCES JEDEC JEITA 3.38 1.70 34.16 9.91 27.94 3.12 1.45 33.91 9.65 0.133 0.067 1.345 0.390 1.100 0.123 0.057 0.380 1.335 EUROPEAN PROJECTION Product specification BLF2022-70 SOT502A 0.25 0.51 0.01 0.02 ISSUE DATE 99-12-28 03-01-10 ...

Page 10

... Product specification BLF2022-70 DEFINITION These products are not Philips Semiconductors ...

Page 11

... Philips Semiconductors UHF power LDMOS transistor 2003 Feb 24 NOTES 11 Product specification BLF2022-70 ...

Page 12

Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. © Koninklijke Philips Electronics N.V. 2003 All rights are reserved. Reproduction in whole or in part is prohibited ...

Related keywords