S29CD016G SPANSION, S29CD016G Datasheet - Page 87

• Manufacturer Part Number: S29CD016G
• Description: 16 Megabit (512 K x 32-Bit) CMOS 2.5 Volt-only Burst Mode / Dual Boot / Simultaneous Read/Write Flash Memory
• Manufacturer: SPANSION

Physical Dimensions
LAA080–80-ball Fortified Ball Grid Array (13 x 11 mm)
November 5, 2004 S29CD016_00_A4
A
CORNER
PACKAGE
JEDEC
SYMBOL
A2
0.20
A1
A
A1
A2
D
E
D1
E1
MD
ME
N
φb
eD
eE
SD/SE
2X
A1
C
1.00±0.5
MIN
0.40
0.60
0.50
--
13.00 x 11.00 mm
A1 CORNER ID.
(INK OR LASER)
13.00 BSC.
11.00 BSC.
PACKAGE
9.00 BSC.
7.00 BSC.
1.00 BSC.
1.00 BSC.
0.50 BSC
LAA 080
NOM
0.60
N/A
10
80
--
--
--
8
SIDE VIEW
A d v a n c e
TOP VIEW
D
MAX
1.40
0.70
--
--
SEATING PLANE
PROFILE HEIGHT
STANDOFF
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH - D DIRECTION
BALL PITCH - E DIRECTION
SOLDER BALL PLACEMENT
NOTE
I n f o r m a t i o n
A
C
S29CD016G
0.20
2X
E
B
C
0.25
0.15 C
eE
C
6
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9.
NXφb
eD
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010
(EXCEPT AS NOTED).
SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE "D"
DIRECTION. SYMBOL "ME" IS THE BALL COLUMN MATRIX
SIZE IN THE "E" DIRECTION. N IS THE TOTAL NUMBER OF
SOLDER BALLS.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW. WHEN THERE IS AN ODD NUMBER
OF SOLDER BALLS IN THE OUTER ROW PARALLEL TO THE D
OR E DIMENSION, RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW , SD OR SE = e/2
N/A
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
φ0.25 M
φ0.10
K
M
C
C
J
A
B
H
BOTTOM VIEW
G
F
D1
E
SD
D
C
7
B
A
8
7
6
5
4
3
2
1
SE
CORNER
3214\38.12C
A1
7
E1
87