UPD70208HGF-16-3B9 NEC, UPD70208HGF-16-3B9 Datasheet - Page 105

• Manufacturer Part Number: UPD70208HGF-16-3B9
• Description: V40HLTM/ V50HLTM 16/8/ 16-BIT MICROPROCESSOR
• Manufacturer: NEC

(2)
Infrared reflow
VPS
Partial pin heating
Infrared reflow
VPS
Partial heating
Soldering Method
Soldering Method
(a) K, E, X masks
(b) P, M, L, F masks
PD70208HGK- -9EU : 80-pin plastic TQFP (fine pitch) (12
PD70216HGK- -9EU : 80-pin plastic TQFP (fine pitch) (12
Note
Caution Do not use one soldering method in combination with another. (however, partial pin heating can
This means the number of days after unpacking the dry pack. Storage conditions are 25 C and 65% RH
max.
be performed with other soldering methods).
Package peak temperature : 230 C, Time: 30 sec. max. (210 C min.),
Number of timers: 1, Number of days
at 125 C for 10 hours)
Package peak temperature: 215 C, Time: 40 sec. max. (200 C min.),
Number of times: 1, Number of days
at 125 C for 10 hours)
Pin temperature: 300 C max., Time: 3 sec. max. (per device side)
Package peak temperature: 235 C, Time: 30 sec. max. (210 C min.),
Number of times: 2 max., Number of days
necessary at 125 C for 10 hours).
Package peak temperature: 215 C, Time: 40 sec. (200 C min.), Number of times:
2 max., Number of days
for 10 hours).
Pin temperature: 300 C max., Time: 3 sec. max. (per device side)
Note
: 7 days (after this prebaking is necessary at 125 C
Data Sheet U13225EJ4V0DS00
Soldering Conditions
Soldering Conditions
Note
Note
: 1 day (after this, prebaking is necessary
: 1 day (after this, prebaking is necessary
Note
: 7 days (after this, prebaking is
12 mm)
12 mm)
PD70208H, 70216H
Conditions Symbol
Conditions Symbol
Recommended
Recommended
VP15-101-1
VP15-107-2
IR30-101-1
IR35-107-2
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