DAC1405D750HW NXP [NXP Semiconductors], DAC1405D750HW Datasheet - Page 38

• Manufacturer Part Number: DAC1405D750HW
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
12. Abbreviations
DAC1405D750_1
Preliminary data sheet
Table 43.
Acronym
B
CDMA
CML
CMOS
DAC
FIR
GSM
IF
IMD3
LISB
LMDS
LSB
LTE
LVDS
MMDS
MSB
NCO
NMOS
PLL
SFDR
SPI
TD-SCDMA
UISB
WCDMA
WiMAX
Abbreviations
All information provided in this document is subject to legal disclaimers.
Description
Bandwidth
Code Division Multiple Access
Current Mode Logic
Complementary Metal-Oxide Semiconductor
Digital-to-Analog Converter
Finite Impulse Response
Global System for Mobile communications
Intermediate Frequency
Third-order InterModulation Distortion
Lower Intermediate Significant Byte
Local Multipoint Distribution Service
Least Significant Bit
Long Term Evolution
Low-Voltage Differential Signaling
Multichannel Multipoint Distribution Service
Most Significant Bit
Numerically Controlled Oscillator
Negative Metal-Oxide Semiconductor
Phase-Locked Loop
Spurious-Free Dynamic Range
Serial Peripheral Interface
Time Division-Synchronous Code Division Multiple Access
Upper Intermediate Significant Byte
Wideband Code Division Multiple Access
Worldwide Interoperability for Microwave Access
Rev. 01 — 10 March 2010
Dual 14-bit DAC, up to 750 Msps; 4× and 8× interpolating
DAC1405D750
© NXP B.V. 2010. All rights reserved.
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